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A method for monitoring wafers

A technology for monitoring wafers and graphics, used in semiconductor/solid-state device testing/measurement, electrical components, circuits, etc., and can solve the problem of non-substitutable monitoring wafers

Active Publication Date: 2018-12-25
FOUNDER MICROELECTRONICS INT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, the monitor wafer obtained by the method of two-layer etching is not substitutable

Method used

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  • A method for monitoring wafers
  • A method for monitoring wafers
  • A method for monitoring wafers

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Embodiment Construction

[0028] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0029] prior art figure 1 The medium monitoring wafer (wafer) includes the outer box structure 01 and the inner box structure 02. The outer box structure 01 is the outer box, and the inner box structure 02 is the inner box. For the monitoring wafer of the Quaestor Q7 (5) series machine, it is square. The inner box is a square with a side length of 10um, the inner edge of the outer box is a square with a side length of 20um, and the outer edge of the outer box is a square with a side length of 30um.

[0030] The measurement results obtained by using the monitoring wafer of the prior art are X direction: (x2-x1) / 2; Y direction: (y2-y1) / 2, where x1 is the right inner edge of...

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Abstract

The invention discloses a monitoring wafer and a preparation method thereof. The monitoring wafer is provided with an outer box structure, wherein an inner edge and an outer edge of the outer box structure are concentric patterns. According to the invention, a wafer, which is acquired by single-layer etching and provided with the outer box structure, is adopted to act as the monitoring wafer. A monitoring wafer in the prior art comprises an outer box structure and an inner box structure and can be acquired by two-layer etching. The monitoring wafer disclosed by the invention only has the outer box structure, that is, the monitoring wafer can be acquired by only single-layer etching. A registration error between two layers of patterns does not exist in single-layer etching, thereby being capable of realizing that central values in the X-direction and in the Y-direction are zero. A specific target value is provided, and conformation and adjustment can be carried out timely when abnormal conditions such that the target value of a machine drifts and the like. When an existing monitoring wafer is damaged, a wafer with the same outer box structure can be used to replace the damaged monitoring wafer immediately, thereby having the substitutability.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing, in particular to a method for using a monitoring wafer. Background technique [0002] In semiconductor processing technology, overlay is one of the most important monitoring items in photolithography technology, which directly reflects the registration status between graphics. As the overlay measuring machine, the Quaestor Q7(5) equipment, its stable measurement process is an inevitable prerequisite for the authenticity of data and a reliable guarantee for product quality. [0003] In the semiconductor manufacturing industry, the overlay measurement process stability monitoring of Quaestor Q7(5) series machines usually includes two aspects: first, whether the measurement results of a single machine are consistent during the long-term production process; Whether the measurement results of the machine in the same period are consistent. Whether it is a single machine measurement o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66H01L21/673
CPCH01L21/673H01L22/26
Inventor 张彦平
Owner FOUNDER MICROELECTRONICS INT