A molding fixture for potting composite heat-conducting materials for traveling wave tubes and a method for potting composite materials

Abstract

The invention discloses a forming clamp for potted composite heat conduction materials of a traveling-wave tube, and a method for potting the composite materials. The forming clamp comprises two bondage plates, screws and grooves, and screw through holes for being fixedly connected with the screws are further formed in the bondage plates; the screw through holes are formed in the grooves, and threaded holes are formed in high frequency circuit supporting seats on a traveling-wave tube substrate; and through the depth of the grooves and cooperation of the high frequency circuit supporting seats on the traveling-wave tube substrate, the forming position of the composite heat conduction materials is set. Through the technical scheme, the composite heat conduction materials of the potted traveling-wave tube are controlled within the designed range, and the mechanical means is not required to be used for removing redundant composite heat conduction materials; and the damage of vibration and impact generated in the process of removing the redundant composite heat conduction materials to the traveling-wave tube is avoided.

Description

technical field [0001] The invention relates to a fixture and a method for using the same, in particular to a forming fixture for potting composite heat-conducting materials in traveling wave tubes and a method for potting composite materials. Background technique [0002] Electronic components need to dissipate heat when they work, especially electronic components with high power density. The quality of heat dissipation measures for electronic components directly affects the reliability and life of electronic components, and can even affect the electrical parameters of electronic components. The heat dissipation of electronic components is an important link in the design of electronic components. When potting composite heat-conducting materials to the high-frequency slow-wave region of the traveling wave tube, the composite heat-conducting materials need to be bound. If the traditional potting material binding method Applied to the potting of composite heat-conducting mater...

AI Technical Summary

Problems solved by technology

The heat dissipation of electronic components is an important link in the design of electronic components. When potting composite heat-conducting materials to the high-frequency slow-wave region of the traveling wave tube, the composite heat-conducting materials need to be bound. If the traditional potting material binding method Applied to the potting of composite heat-conducting materials, firstly when the composite heat-conducting material is compacted, the composite heat-conducting material will generate a certain extrusion stress on the side wall, which will cause the binding plate to shift, and the composite heat-conducting material after potting will exceed the design range, which will affect the subsequent electronics. Subsequent process of components; secondly, when heat-treating the composite heat-conducting material, due to the thermal expansion of the composite heat-conducting material itself, the binding plate is displaced, and the composite heat-conducting material after potting exceeds the design range, which will also affect the follow-up of subsequent electronic components. In the process, in order to remove the excess composite heat-conducting material, hammers and chisels are generally used to remove the excess part. In severe cases, it is even necessary to use a milling machine to remove the excess composite heat-conducting material before proceeding to the subsequent process

In the process of removing redundant composite heat-conducting materials, vibration and impact mechanical damage are caused to electronic components, affecting the performance of electronic components and even causing damage to electronic components

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