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Packaging structure for MEMS microphones

一种封装结构、麦克风的技术，应用在传感器零部件、传感器、静电换能器传声器等方向，能够解决输出幅值限制MEMS麦克风工作带宽等问题，达到提高高频截止频率、提高工作带宽、降低高频响应的效果

Active Publication Date: 2015-08-05
GOERTEK MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The sharp increase in the output amplitude of the high frequency limits the working bandwidth of the MEMS microphone.

Method used

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  • Packaging structure for MEMS microphones
  • Packaging structure for MEMS microphones
  • Packaging structure for MEMS microphones

Examples

Experimental program
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Embodiment Construction

[0023] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0024] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0025] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0026] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

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Abstract

The invention discloses a packaging structure for MEMS microphones, comprising a packaging substrate and a packaging shell. The packaging shell is arranged on the packaging substrate, and the packaging shell and the packaging substrate form an airtight cavity. The packaging structure further comprises a sound hole through which sound can flow into the airtight cavity. The packaging shell, the packaging substrate and the sound hole constitute a Helmholtz resonant cavity which is internally provided with an MEMS chip and an ASIC chip. At least part of the inner wall of the Helmholtz resonant cavity is coated with a sound absorption layer. According to the packaging structure of the invention, the inner wall of the Helmholtz resonant cavity is coated with the sound absorption layer which has certain capability of high-frequency sound wave absorption and lower capability of low-frequency sound wave absorption and can be equivalent to a low-pass filter. Through high-frequency sound wave absorption, the high-frequency amplitude of sound waves can be suppressed, so that the frequency response of the Helmholtz resonance cavity is reduced, that is to say, the high-frequency cut-off frequency of sound waves is improved, and the working bandwidth of MEMS microphones is improved.

Description

technical field [0001] The invention relates to a microphone, which belongs to the field of acoustic-electric conversion, and more particularly relates to a packaging structure of a MEMS microphone. Background technique [0002] MEMS (Micro-Electro-Mechanical Systems) microphones are microphones manufactured based on MEMS technology. The diaphragm and back plate are important components of the MEMS microphone. conversion. [0003] The package structure of MEMS microphone is as follows: figure 1 As shown, the MEMS chip 3 and the ASIC chip 2 are mounted on the package substrate 1, and the two are connected together by bonding, and then the package shell 4 with the sound hole 5 is mounted on the package substrate 1 to form a MEMS microphone. anterior cavity. The front cavity of the MEMS microphone forms a Helmholtz resonant cavity, and the incident sound wave enters the front cavity of the MEMS microphone from the sound hole 5. As the incident frequency increases, the intens...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/04H04R31/00
CPCH04R19/04H04R19/005H04R1/222H04R1/2807H04R1/2876H04R2201/003
Inventor 郑国光
Owner GOERTEK MICROELECTRONICS CO LTD