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89results about How to "Improve high frequency response" patented technology

Structure of multi-tier wire bonding for high frequency integrated circuit

A multi-wire wire-bonding structure suitable for a high frequency signal comprises a first electronic device, a second electronic device, a chip pad and a plurality of metal wires. The first electronic device is attached to the second electronic device with the chip pad. As a result, the first electronic device and the second electronic device form a stair-like structure. A plurality of bonding pads comprises at least one signal bonding pad and grounded bonding pads. The signal bonding surface is surrounded by the ground bonding pads. All the bonding pads are located at the surface of the first electronic device. The chip pad carries the first electronic device and the exceeding part is a ring grounded bonding pad which surrounds the first electronic device. The second electronic device carries the chip pad and a margin of the second electronic device is exceeding the chip pad. There are several leads on the margin of the second electronic device in corresponding to the ground bonding pads and the signal bonding pad. Metal wires comprise a signal wire and grounding wires. The bonding pads of the first electronic device are classified as the first row bonding pads which is close to the ring ground bonding surface and the second row bonding pads which is away from the ring ground bonding surface. The signal wire electrically connects to the signal bonding pads and the corresponding lead. The ground wires electrically connect to the first row bonding pads and the ring ground bonding surface.
Owner:VIA TECH INC

System-on-chip driver of high-subdivision multi-path stepping motor

The invention relates to a system-on-chip drive of a high-subdivision multi-path stepping motor, belonging to the field of motor control and solving the problems that the traditional stepping motor has the defects of low-frequency oscillation and poor high-frequency output and can not meet the requirement that a plurality of stepping motors work simultaneously and coordinately. The output end of a dial-up switch is connected with the input end of an FPGA main control circuit, the FPGA (Field Programmable Gata Array) main control circuit is provided with n paths of motor output ports, each path of motor output port is connected with the input end of an optical coupler isolation circuit, the output end of the optical coupler isolation circuit is connected with the input end of a drive circuit, the output end of the drive circuit is connected with the input end of a three-phase inversion bridge, three output ends of the three-phase inversion bridge are respectively a three-phase drive current output end of the motor, three current mutual inductors are respectively used for acquiring output currents of three output ends of the three-phase inversion bridge, a phase current signal of the stepping motor, acquired from each current mutual inductor, is output to an overcurrent protection circuit, and the output end of the overcurrent protection circuit is connected with the overcurrent control input end of the drive circuit.
Owner:HARBIN INST OF TECH

Structure of multi-tier wire bonding for high frequency integrated circuit

A multi-wire wire-bonding structure suitable for a high frequency signal comprises a first electronic device, a second electronic device, a chip pad and a plurality of metal wires. The first electronic device is attached to the second electronic device with the chip pad. As a result, the first electronic device and the second electronic device form a stair-like structure. A plurality of bonding pads comprises at least one signal bonding pad and grounded bonding pads. The signal bonding surface is surrounded by the ground bonding pads. All the bonding pads are located at the surface of the first electronic device. The chip pad carries the first electronic device and the exceeding part is a ring grounded bonding pad which surrounds the first electronic device. The second electronic device carries the chip pad and a margin of the second electronic device is exceeding the chip pad. There are several leads on the margin of the second electronic device in corresponding to the ground bonding pads and the signal bonding pad. Metal wires comprise a signal wire and grounding wires. The bonding pads of the first electronic device are classified as the first row bonding pads which is close to the ring ground bonding surface and the second row bonding pads which is away from the ring ground bonding surface. The signal wire electrically connects to the signal bonding pads and the corresponding lead. The ground wires electrically connect to the first row bonding pads and the ring ground bonding surface.
Owner:VIA TECH INC

Automatic sorting circuit based on the parallel use of SiCMOSFET device, and automatic sorting method

The invention discloses an automatic sorting circuit based on the parallel use of the sic MOSFET devices. A power supply unit I supplies power to the drain electrode of the device through a series load, a current monitoring unit I is used for measuring the current passing through the device, and the driving unit I provides required modulation driving for the device. A power supply unit II suppliespower to Q1 through a constant current source, and the grid electrode of the Q1 is connected with a driving unit II. A current monitoring unit II is used for measuring the current passing through theQ1, and the driving unit II is used for providing driving for the Q1, and is in signal synchronization with the driving unit. A voltage monitoring unit I is used for measuring the voltage of the drain electrode of the Q1, and a voltage monitoring unit II is used for measuring the driving voltage of the grid electrode of the device. The invention further discloses an automatic sorting method. According to the invention, the conduction impedance is measured by adopting an isolation measurement method; the circuit structure is simple, and the monitoring voltage is always low; the forward conducting voltage drop of the diode is enabled to be consistent by adopting a double-diode back-to-back connection method; a specific ultra-small junction capacitor diode is adopted, so that the measuring frequency is the same as the actual working frequency and is in conformity with the fact.
Owner:江苏矽导集成科技有限公司

In-well seismic data acquisition device and method based on MEMS optical fiber detector

The invention discloses an in-well seismic data acquisition device and acquisition method based on an MEMS optical fiber detector, and the device comprises a ground artificial seismic source and a plurality of in-well three-component optical fiber seismic signal receiving and acquisition short circuits which are connected with a ground composite modulation and demodulation instrument through armored photoelectric composite cables. The armored photoelectric composite cable controls the depth position of the three-component optical fiber seismic signal receiving and collecting pup joint in the well and synchronously collects DASVSP data; a three-component optical fiber seismic signal sensor module and a three-component optical fiber attitude sensor are installed in each in-well three-component optical fiber seismic signal receiving and acquisition short circuit. The device is high in sensitivity, the acquisition device is very simple, the acquisition device descends into all high-temperature wells to acquire three-component seismic data or micro-seismic data in the high-quality wells, DAS-VSP data of the whole well section above a detector are synchronously acquired, and powerful technical support is provided for application of the oil reservoir geophysical technology.
Owner:OPTICAL SCI & TECH (CHENGDU) LTD

Hook vibration prevention hammer

The hook shockproof hammer of the invention relates to a protecting tool which absorbs the vibration energy of the aerial cable, and is especially suitable for the hook shockproof hammer used by the optical cable circuit. The structure of the hook shockproof hammer comprises a hook, a pre-twisted wire, a steel twisted wire, a bug hammerhead and a small hammerhead; the hook body at the upper part of the hook is sleeved on the cable, the upper part of the hook body of the hook is arranged with a through hole, the pre-twisted wire traverses the through hole at the upper part of the hook and is permanent-connected with the cable; the lower part of the hook is arranged with a through hole, the middle part of steel twisted wire is fixed in the through hole at the lower part of the hook, the two ends of the steel twisted wire respectively extend into the inner bottom of the large and small hammerheads and are permanent-connected with the connecting glue. The protecting tool of the invention has the advantages of being able to reduce the problem of large compression stress of the shockproof hammer to part of the cable, changing the rigid connection of the bolt connection to a flexible connection, strengthening the self-damping of the cable, effectively preventing the phenomenon of the shockproof hammer sliding because of the loosening of the screw, broader covering area of the frequency, better high-frequency response, being able to satisfy the special shock-proof request to power thereby ensuring the safe operation of the circuit.
Owner:JIANGSU ZHONGTIAN TECH CO LTD

Earthquake simulation vibrostand control method

ActiveCN107687925ASolve the problem of out-of-sync displacementAvoid additional internal forceVibration testingControl signalEngineering
The invention relates to an earthquake simulation vibrostand control method, which belongs to the technical field of structural experiment. According to the control method, a differential signal of anacceleration instruction signal and a differential signal of an acceleration feedback signal are obtained by virtue of differentiation, a difference between the displacement feedforward and feedbackis integrated to obtain a displacement error integral signal, summation is performed for the acceleration instruction differential signal, the acceleration feedback differential signal and the displacement error integral signal and the known three parameter instruction signal, thereby obtaining a composite multi-parameter control signal. Compared with the existing three-parameter control method, the acceleration feedback differential signal in the multi-parameter control algorithm can reduce the influence of system resonance frequency and can increase the system bandwidth; the acceleration instruction differential signal can increase the system frequency band and can improve the system high-frequency performance; and the displacement error integral signal can reduce a displacement static error of a multi-vibrostand system and can improve the low-frequency control performance of the system.
Owner:BEIJING UNIV OF TECH

Submarine optical fiber four-component seismic instrument system and data acquisition method thereof

The invention relates to a submarine optical fiber four-component seismic instrument system and a data acquisition method thereof. Four-component node seismic instruments are connected in series to an armored photoelectric composite cable at certain intervals through a circular cable ring; the armored photoelectric composite cable is connected with a computer; an external close-range wireless transmission module, an external photoelectric conversion module and an external wireless charging module are arranged on the side face of each four-component node seismic instrument in a matched mode, and all the modules are fixed to the armored photoelectric composite cable through functional module sleeves; and the four-component node seismic instruments are connected with the computer through the external close-range wireless transmission modules and carries out communication and data transmission. The system has the advantages of high sensitivity, wide frequency band, good high-frequency response, flat frequency characteristic response, linear phase change and good technical parameter consistency; and since no electronic element is arranged at the front end, the device has the advantages of higher reliability, resistance to high temperature and high voltage, no need of power supply, water resistance, corrosion resistance, capability of being arranged for a long time, electromagnetic interference resistance and small channel cross-talk.
Owner:BGP OF CHINA NAT GASOLINEEUM CORP +1

Array type in-well four-component optical fiber seismic data acquisition device and data acquisition method

The invention discloses an array type in-well four-component optical fiber seismic data acquisition device and a data acquisition method. The system comprises a ground artificial seismic source and aplurality of in-well four-component optical fiber seismic signal receiving and acquiring short circuits, and the in-well four-component optical fiber seismic signal receiving and acquiring short circuits are connected with a data acquisition control and modulation-demodulation instrument through armored photoelectric composite cables; a four-component optical fiber seismic signal sensing unit, a three-component optical fiber attitude sensor and an optical fiber inertial navigation gyroscope are arranged in each well four-component optical fiber seismic signal receiving and acquiring short circuit. According to the invention, a high-temperature-resistant three-component optical fiber detector and an optical fiber hydrophone are adopted underground; the frequency band range is larger than the frequency band response of the seismic signals in the well, the sensitivity is high, the underground four-component optical fiber seismic data acquisition device is very simple, the acquisition device can go down to all high-temperature wells to acquire the seismic data in the well, and powerful technical support is provided for efficient development of oil and gas fields.
Owner:OPTICAL SCI & TECH (CHENGDU) LTD
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