Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

An electronic device and a method for making the shield

A technology of electronic equipment and shielding parts, which is applied in the field of electronics, can solve the problems of thick thickness and increase the thickness of electronic equipment, and achieve the effect of preventing influence and avoiding the outward radiation of electromagnetic waves

Active Publication Date: 2019-04-30
HUAWEI DEVICE CO LTD
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, since the thickness of the metal die-casting itself is relatively thick, a conductive film is pasted on the hole or groove of the die-casting metal, which further increases the thickness of the electronic device.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • An electronic device and a method for making the shield
  • An electronic device and a method for making the shield
  • An electronic device and a method for making the shield

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Such as figure 1 As shown, is a schematic structural diagram of an electronic device 100 according to an embodiment of the present invention. The electronic device can be mobile phone, PAD, computer, TV, server and other devices. The electronic device 100 includes a metal part 10 , a circuit board 20 and a shielding part 30 .

[0036] The metal piece 10 is provided with a through hole or a slot 11, and the shape and size of the hole or slot 11 can be set according to requirements. The function of opening the through hole or slot 11 is mainly to reduce the metal weight of the electronic device 100, or to release stress, or to make way for the electronic devices in the electronic device 100, or to be fixed on the metal part 10 for fixing. components. Therefore, as required, the number of said through holes or slots 11 can be one or more. Such as figure 1 As shown, the number of the through hole or slot 11 is one, and the purpose of opening the through hole or slot 11...

Embodiment 2

[0064] Based on the same inventive concept, the present application also provides a method for making a shield, such as Figure 7 As shown, it is a flow chart of the manufacturing method of the shielding member according to the embodiment of the present invention. Simultaneously combine figure 1 , the manufacturing method of the shielding member comprises the following steps:

[0065] Step 210, opening a through hole or a groove 11 on the metal part 10, the metal part 10 may be a metal stamping part or a metal forging part;

[0066] Step 220, forming a shielding part 31 on the metal part 10 by using a conductive plastic material through injection molding, and the shielding part 31 is used to shield the through hole or groove 11;

[0067] Step 230 , forming the enclosing portion 33 for enclosing the electronic device 21 on the circuit board 20 by metal or conductive plastic material.

[0068] Specifically, the method further includes: step 240, using plastic material to form...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The embodiment of the present invention discloses an electronic device and a manufacturing method of a shielding part. The electronic device includes a metal part, a circuit board and a shielding part. The metal part is provided with through holes or grooves, and the metal part is a metal stamping part. or metal forging parts; the circuit board is arranged opposite to the metal part, and electronic devices are arranged on it; the shielding part is fixed on the metal part, and the shielding part includes a shielding part and a closing part, and the shielding part The part is made of conductive plastic material, the sealing part is made of metal or conductive plastic material, the shielding part is used to cover the through hole or groove, the sealing part is surrounded by the electronic device, and One end is electrically connected to the metal part, and the other end is electrically connected to the circuit board. A shielding space is formed between the metal part, the shielding part, the closing part and the circuit board, and the electronic device is located in the circuit board. in the above-mentioned shielded space.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to an electronic device and a manufacturing method of a shielding member. Background technique [0002] With the development of science and technology and the progress of society, electronic devices such as mobile phones, computers, and televisions have become an indispensable part of people's lives and work. Electronic equipment generally includes a circuit board on which electronic devices are installed and a die-cast metal part with holes or slots, wherein the die-cast metal part also serves as a shielding space for the electronic device. The purpose of opening the holes or slots is to reduce the weight of the die-cast metal parts, or due to the space constraints of the product structure and the layout of the devices, the holes or slots need to be opened (such as: the device is high, in order not to increase the overall thickness, the required Partial openings or grooves in ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K9/00
CPCH05K9/0022G06F1/1656G06F1/182H05K9/0081B29C45/14639B29K2995/0005B29L2031/3481H05K9/0049
Inventor 靳林芳邹杰孙浩杨明星
Owner HUAWEI DEVICE CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com