Full-automatic hard box stretch film cutting damping device

Abstract

The invention discloses a full-automatic hard box stretch film cutting damping device. The device comprises a lower frame plate, an upper frame plate, a cutter set, a cutter support plate, a silica gel buffer plate and a push plate, and is characterized in that a cylinder is arranged at the lower side of the lower frame plate, wherein the cylinder is connected with the push plate; the cutter support plate is arranged above the push plate; the cutter set is arranged at the upper side of the cutter support plate; the upper frame plate is arranged above the cutter set; the silica gel buffer plate is arranged at the lower side of the upper frame plate; a cutter plate is arranged at the lower side of the silica gel buffer plate; guide rail brackets are arranged at the left and right sides of the upper side of the lower frame plate, and penetrate through the cutter support plate to be connected with the upper frame plate; and the push plate is positioned between the lower frame plate and the cutter support plate. The full-automatic hard box stretch film cutting damping device has the following beneficial effects: the cutter plate can be automatically adjusted in the cutting process according to the cutter conditions to prevent the problems of low yield, low productivity and high production cost caused by incomplete product cutting, ununiform cutting and rough sections.

Description

technical field [0001] The invention relates to a cutting device, in particular to a full-automatic hard box stretch film integral cutting buffer device. Background technique [0002] At present, the cutting knife and the cutting plate on the ordinary hard box stretch film packaging machine require high precision and are prone to failure. When cutting multiple products, once the position of a certain cutter changes, the contact with the cutter plate will not be in place, the product will be cut continuously, the cut will be uneven, and the cut surface will be rough. All adjustments to the cutter will be required, resulting in high production costs. , High labor intensity and low production efficiency. Contents of the invention [0003] The purpose of the present invention is to provide a cutting buffer device which can automatically adjust the cutting plate according to the cutting knife condition during the cutting process. [0004] In order to achieve the above object,...

AI Technical Summary

Problems solved by technology

[0005] Due to the adoption of the above-mentioned technical scheme, the beneficial effect of the present invention is that by relying on the elasticity of the silica gel buffer plate, the cutter plate attached to the silica gel buffer plate is adjusted, so that the cutter plate and the cutter group overlap closely, and the problem of continuous cutting of lead products is solved. Uneven, rough cutting surface, need to adjust all the cutters, resulting in high production cost, high labor intensity and low production efficiency

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