Preparation method of PVDF (polyvinylidene fluoride) film and PVDF film
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- NORTHWEST INST OF NUCLEAR TECH
- Publication Date
- 2015-09-02
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention relates to a method for preparing a PVDF film with high β-phase crystal content, dense and non-porous, high electric strength and high dielectric constant, which can be used for capacitors with high energy storage density, and belongs to the technical field of film material preparation. Background technique
[0002] Polyvinylidene fluoride (polyvinylidine fluoride, referred to as PVDF) has excellent piezoelectric, ferroelectric, and thermoelectric properties, and is widely used in the preparation of new memories, capacitors, piezoelectric and thermoelectric converters. There are two methods of preparing PVDF film: melt extrusion, biaxial stretching and solution casting. The PVDF film prepared by melt extrusion biaxial stretching has good compactness and high electrical strength, but this method requires expensive equipment and a large amount of material, and is suitable for mass production. The process of preparing PVDF film by solution ...