Insulated medium size for thick-firm circuit

Abstract

Dispersing glass powder possessing insulation property on organic medium evenly with or without inorganic pigment being added forms the invented pulp. Viscosity and rheological property of the pulp can be adjusted to suit specific coating method such as silkscreen printing and spray coating. Feasible manufacturability of the pulp is obtained by designing formulation of glass and organic medium reasonably. Technical parameters of the pulp are: sintering temperature 540-600 deg.C, average thermal expansion coefficient of insulated medium layer (73 minus or plus 3)*10 to the power -7 / C. The invented pulp is applicable to Al2O3 ceramic wafer or general conduction film substrate glass. Using method of silkscreen printing and spray coating makes wet film through drying and sintering processes etc. forming insulation layer in thick film circuit. The insulation layer provides high electrical intensity.

Description

technical field

[0001] Thick-film circuit paste refers to a mixture of metal and glass and / or ceramic powder dispersed in an organic medium, and these pastes are coated on a non-conductive substrate to form a conductive, resistive or insulating film. Insulating dielectric paste for thick film circuits is widely used in electronic components and optoelectronic devices. The thick film multilayer circuits of these devices are usually composed of several conductive layers formed on the insulating layer. There is an insulating layer between the conductive layers, and the conductive circuits between the layers are interconnected through through holes. In a single-layer circuit, an insulating substrate (such as Al 2 o 3 Ceramics, or conductive film glass) are made of insulating dielectric paste to carry the resistance, capacitance and other components and wiring formed on it. Background technique

[0002] In the prior art, the insulating layer formed after sintering the insulati...