Insulated medium size for thick-firm circuit

An insulating medium and thin-film circuit technology, applied in the field of insulating medium paste for thick-film circuits, can solve the problems of pinholes, short life, and low device yield.

Inactive Publication Date: 2004-06-30
张来斌
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the prior art, the insulating layer formed after sintering the insulating paste is prone

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0021] Example 1

[0022] 1) Preparation of insulating glass: PbO 60%, B 2 O 3 15%, SiO 2 20%, Al 2 O 3 3%, TiO 2 1%, ZrO 2 1%, uniformly mixed by weight, kept at 1350°C for 30 minutes and melted, poured the glass liquid on a roller machine and pressed it into a 1-2mm thick sheet, which was ground and passed through a 100-mesh sieve for use.

[0023] 2) Mix the 100-mesh glass powder and the commercially available black pigment for ceramics in a weight ratio of 90:10. Then finely ground to a maximum particle size of less than 10 μm, and the average particle size is D 90 less than 5μm. called inorganic powder.

[0024] 3) Preparation of organic medium: first mix terpineol, butyl carbitol acetate (diethylene glycol butyl ether acetate), and dibutyl phthalate in a weight ratio of 40%, 40%, and 20% uniform, called solvent. Ethyl cellulose was then added as a thickener. The weight ratio of ethyl cellulose to solvent was 6:94. After heating to 60~90℃ to dissolve, it ...

Example Embodiment

[0028] Example 2

[0029] 1) Preparation of insulating glass: PbO 62%, B 2 O 3 10%, SiO 2 21%, Al 2 O 3 1%, TiO 2 1%, ZrO 2 3%, Bi 2 O 3 2%, mixed uniformly by weight, kept at 1360°C for 30 minutes and melted, poured the glass liquid onto a roller machine and pressed it into a 1-2mm thick sheet, ground the glass sheet and passed it through a 100-mesh sieve for use.

[0030] 2) Mix the glass powder that has passed through a 100-mesh sieve and a commercially available blue pigment for ceramics in a weight ratio of 96:4. Then finely ground to a maximum particle size of less than 10 μm, and the average particle size is D 90 less than 5μm. called inorganic powder.

[0031] 3) Preparation of organic medium: firstly mix terpineol and butyl carbitol in a weight ratio of 50% and 50%, then add 3% by weight of dispersant, defoamer, anti-settling agent and other auxiliary agents , called the solvent. Ethyl cellulose and nitrocellulose were added as thickeners. The weigh...

Example Embodiment

[0034] Example 3

[0035] 1) Preparation of insulating glass: PbO 65%, B 2 O 3 5%, SiO 2 25%, Al 2 O 3 2%, TiO 2 0.5%, ZrO 2 0.5%, CaO 1%, ZnO 1%. Mix evenly by weight, keep at 1350°C for 30 minutes to melt, pour the glass liquid on a roller machine and press it into a 1-2mm thick sheet, grind the glass sheet and pass it through a 100-mesh sieve for use.

[0036] 2) Mix the glass powder that has passed through a 100-mesh sieve and a commercially available red pigment for ceramics in a weight ratio of 91:9. Then finely ground to a maximum particle size of less than 10 μm, and the average particle size is D 90 less than 5μm. called inorganic powder.

[0037] 3) Preparation of organic medium: firstly, ethyl acetate, butyl carbitol, and auxiliary (defoamer, anti-settling agent) are mixed uniformly at a weight ratio of 40%, 57%, and 3%, which is called a solvent. Then polymethacrylate was added as thickener and lecithin as dispersant. The weight ratios of polymethac...

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PUM

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Abstract

Dispersing glass powder possessing insulation property on organic medium evenly with or without inorganic pigment being added forms the invented pulp. Viscosity and rheological property of the pulp can be adjusted to suit specific coating method such as silkscreen printing and spray coating. Feasible manufacturability of the pulp is obtained by designing formulation of glass and organic medium reasonably. Technical parameters of the pulp are: sintering temperature 540-600 deg.C, average thermal expansion coefficient of insulated medium layer (73 minus or plus 3)*10 to the power -7/C. The invented pulp is applicable to Al2O3 ceramic wafer or general conduction film substrate glass. Using method of silkscreen printing and spray coating makes wet film through drying and sintering processes etc. forming insulation layer in thick film circuit. The insulation layer provides high electrical intensity.

Description

technical field [0001] Thick-film circuit paste refers to a mixture of metal and glass and / or ceramic powder dispersed in an organic medium, and these pastes are coated on a non-conductive substrate to form a conductive, resistive or insulating film. Insulating dielectric paste for thick film circuits is widely used in electronic components and optoelectronic devices. The thick film multilayer circuits of these devices are usually composed of several conductive layers formed on the insulating layer. There is an insulating layer between the conductive layers, and the conductive circuits between the layers are interconnected through through holes. In a single-layer circuit, an insulating substrate (such as Al 2 o 3 Ceramics, or conductive film glass) are made of insulating dielectric paste to carry the resistance, capacitance and other components and wiring formed on it. Background technique [0002] In the prior art, the insulating layer formed after sintering the insulati...

Claims

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Application Information

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IPC IPC(8): H01B3/00H01L27/01H01L49/02H05K1/00
Inventor 张来斌
Owner 张来斌
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