Package structure and optical module

Abstract

The present application discloses a packaging structure and an optical module. The packaging structure includes: a printed circuit board, which has a hollow housing portion; a heat dissipation substrate arranged under the printed circuit board, which has a first surface and a second surface, the second surface of the heat dissipation substrate includes a first heat dissipation surface and a second heat dissipation surface that is not coplanar with the first heat dissipation surface; a heat dissipation housing for accommodating the heat dissipation substrate and a printed circuit board, the second surface of the heat dissipation substrate is in contact with the heat dissipation surface The housing is thermally connected, and the heat dissipation housing has a first heat-absorbing surface and a second heat-absorbing surface respectively connected to the first heat-dissipating surface and the second heat-dissipating surface; the power device is directly arranged on the first surface of the heat-dissipating substrate through the receiving part , the power device is thermally connected to the heat dissipation substrate. In the technical solution of the present application, the contact surface between the heat dissipation substrate and the heat dissipation housing is non-planar, which increases the heat dissipation area between the heat dissipation substrate and the heat dissipation housing, and greatly improves the heat dissipation capability of the packaging structure and the optical module.

Description

technical field [0001] The invention belongs to the technical field of manufacturing optical communication components, and in particular relates to a packaging structure and an optical module using the packaging structure. Background technique [0002] With the rapid development of 4G communication and the increasing demand for cloud computing, the market demand for high-speed optical modules is increasing day by day. Taking the 100G optical module as an example, its power consumption has greatly increased compared with the 40G optical module, but if it is necessary to use the same package size as the 40G optical module, the heat generated per unit area will also increase accordingly. In such a case, if a good heat dissipation effect cannot be guaranteed, the performance of the temperature-sensitive electro-optic / photoelectric conversion device in the optical module will be affected or even fail. [0003] In the traditional 40G optical module packaging method, COB (chip on ...

AI Technical Summary

Problems solved by technology

The further defects brought about by this are: 1) The tolerance capability of the current process requires that the via hole design needs to ensure that the welding ring is at least 3-4mil on one side of the drilling hole, and the minimum drilling hole is 0.15mm, that is, the effective heat dissipation cross-sectional area and the occupied PCB The area ratio is less than 1 / 4; 2) Copper paste is used for copper filling, and copper paste contains a certain proportion of adhesive, and its thermal conductivity is smaller than that of pure copper, so it will affect the heat dissipation effect

Images