Sensor element adhering device
A sensor element and bonding technology, which is applied in the field of sensing, can solve problems that affect the accuracy of structural data analysis and unreliable structural data of parts, and achieve the effect of improving accuracy and reliable structural data
Active Publication Date: 2015-10-07
泰安市捷宜复合材料科技有限公司
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Problems solved by technology
Therefore, the structural data of the same type of parts obtained by the existing technology is not reliable, which affects the accuracy of the analysis of the structural data of the parts
Method used
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[0049] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0050] figure 1 It is a schematic structural diagram of the sensor element bonding device provided in Embodiment 1 of the present invention, figure 2 It is a schematic cross-sectional structure diagram of the suction cup of the sensor element bonding device provided in Embodiment 1 of the present invention, image 3 The working schematic d...
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The invention provides a sensor element adhering device. The sensor element adhering device comprises a suction disk, a heating power supply, a mould groove and an electric heater, wherein the electric heater and an adhesive mould are arranged in an inner cavity of a housing of the suction disk in sequence; the electric heater is in contact with the upper end of the adhesive mould and is electrically connected to the heating power supply; an opening is formed in the lower end of the housing of the suction disk; the mould groove is formed in the lower end of the adhesive mould; an opening of the mould groove corresponds to the opening of the lower end of the housing; the mould groove is used for accommodating adhesives for fixing sensor elements; the electric heater is used for heating the adhesives in the mould groove according to the heating power supply. After the adhesives are cured and shaped, the adhesives for adhering the sensor elements on a plurality of parts of the same type are the same in shape; the structural data of the same type of parts detected by the sensor elements is reliable; the accuracy of the structural data analysis of the parts is improved.
Description
technical field [0001] The invention relates to the field of sensor technology, in particular to a sensor element bonding device. Background technique [0002] For components used in the fields of aerospace, automotive and construction, it is necessary to use sensor elements such as resistance strain gauge sensors, piezoelectric sensors, and fiber grating sensors to collect structural data of components. In order to realize the detection of the structural data of the component, it is usually necessary to fix the sensor element on the component to be tested, so that the sensor element can transmit the structural data of the component to be tested to the terminal, and the terminal analyzes the structural data. [0003] In the prior art, an adhesive is used to package the sensor element and bond it to the component to be tested. Usually by manual bonding, the adhesive is applied to the entire upper surface of the sensor element, and then the sensor element coated with adhesive...
Claims
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Login to View More IPC IPC(8): B29C65/48B29C65/78
Inventor 蒙邦克甘民可张博明
Owner 泰安市捷宜复合材料科技有限公司