Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

a drying furnace

A technology for drying furnaces and furnace bodies, which is used in drying, drying solid materials, drying solid materials without heating, etc.

Active Publication Date: 2017-08-25
常州科隆威智能技术有限公司
View PDF13 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a drying oven capable of draining organic matter in view of the problem that organic matter cannot be drained away and is easy to remain in the mounting process of circuit board components.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • a drying furnace
  • a drying furnace
  • a drying furnace

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] The present invention and its beneficial effects will be further described in detail below in conjunction with examples, but the embodiments of the present invention are not limited thereto.

[0017] Such as figure 1 and figure 2 , the embodiment comprises a body of furnace 1, a first air blower 2 and a second air blower 3 arranged at both ends of the body of furnace 1, a third air blower 4 arranged between the first air blower 2 and the second air blower 3, connected with the first air blower 2 The first heating device 21 and the second heating device 31 connected to the second blower 3, the air inlets of the first blower 2 and the second blower 3 are all arranged outside the furnace body 1, and the outlet of the first blower 2 The tuyere is communicated with the inside of the furnace body 1 through the first heating device 21, the air outlet of the second blower 3 is connected with the inside of the furnace body 1 through the second heating device 31, and the air in...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a drying furnace, which comprises a furnace body, a first air blower and a second air blower arranged at two ends of the furnace body, a third air blower arranged between the first air blower and the second air blower, and a The first heating device and the second heating device connected with the second blower, the air inlets of the first blower and the second blower are all arranged outside the furnace body, and the air outlet of the first blower communicates with the furnace through the first heating device Inside the body, the air outlet of the second blower communicates with the interior of the furnace body through the second heating device, and the air inlet of the third blower communicates with the interior of the furnace body. The beneficial effect of the present invention is that the drying furnace can be placed in Around the reflow soldering, wave soldering and other equipment, under the action of several blowers on the drying furnace, the air containing organic matter is sucked into the furnace body, and after passing through the heating tube in the furnace, it becomes hot air, and finally sent out by the blower to achieve exhaustion. Go organic matter purpose.

Description

technical field [0001] The invention belongs to the field of drying furnaces, in particular to a drying furnace for removing organic matter. Background technique [0002] In the process of mounting circuit board components, there are two methods of reflow soldering and wave soldering. The circuit board will use a lot of organic solvents in the process of mounting components, such as board washing water, flux and other organic substances. Residues in equipment or the environment, if not treated in time, will condense after cooling, which will cause great harm to the human body. Contents of the invention [0003] The object of the present invention is to provide a drying oven capable of draining organic matter in view of the problem that organic matter cannot be drained away and is easy to remain in the mounting process of circuit board components. [0004] In order to achieve the above object, the present invention adopts the following technical solutions: [0005] A dryi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): F26B5/12
Inventor 唐岳泉苏金财洗志军
Owner 常州科隆威智能技术有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com