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Device and method for adjusting shell temperature of mobile terminal

A mobile terminal and casing temperature technology, applied in the direction of the structure of the telephone, can solve the problems of cold touch, aggravating the cold feeling, high temperature, surface temperature drop, etc., and achieve the effects of improving user experience, high heat dissipation efficiency, and simple structure

Inactive Publication Date: 2018-01-19
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above-mentioned internal heat dissipation methods often lead to abnormally high temperatures in some areas of the mobile phone casing, making the mobile phone a "hot potato"
[0004] On the other hand, in a colder climate, the mobile phone casing is easily affected by the external temperature, and its surface temperature may drop to a lower level. The cold touch on the surface of the mobile phone aggravates its cold feeling, which often annoys it and also affects the user experience

Method used

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  • Device and method for adjusting shell temperature of mobile terminal
  • Device and method for adjusting shell temperature of mobile terminal
  • Device and method for adjusting shell temperature of mobile terminal

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] A casing temperature adjustment device for a mobile terminal, as attached figure 2 As shown, it includes a thermoelectric cooler and a pulse modulator. The thermoelectric cooler is formed by repeated arrangement and series connection of at least one semiconductor couple pair. The semiconductor couple pair is installed between two ceramic substrates. The first ceramic substrate 1 Adhere to the heating component 2 of the mobile terminal, the second ceramic substrate 3 is close to the shell of the mobile terminal or the second ceramic substrate is used as the shell of the mobile terminal; both ends of the thermoelectric cooler are connected to an H bridge, the The input ends of the H-bridge are respectively connected to the output ends of the pulse modulator; the housing temperature adjustment device also includes a thermosensitive element 4 arranged on the second ceramic substrate, which is used to measure the temperature of the housing of the mobile terminal. The sensit...

Embodiment 2

[0036] The difference between this embodiment and Embodiment 1 is that the H bridge adopts the structure of four triodes, the left bridge of the H bridge includes a PNP transistor Q1 and an NPN transistor Q2, and the right bridge includes a PNP transistor Q3 and an NPN transistor Q4.

Embodiment 3

[0038] The present invention also provides a method for adjusting the casing temperature of a mobile terminal using the casing temperature adjusting device of Embodiment 1, as shown in the attached image 3 As shown, the steps include:

[0039] S301. The thermal element collects the current temperature data of the mobile terminal shell;

[0040] S302. Perform a differential operation on the current temperature data and the preset temperature standard data to obtain differential data;

[0041] S303. Send the differential data to the pulse modulator;

[0042] S304. The pulse modulator adjusts the output pulse based on the differential data;

[0043] S305. The direction and magnitude of the current passing through the thermoelectric cooler change;

[0044] S306, the casing of the mobile terminal is cooled or heated accordingly.

[0045] In step S301, after the thermal sensor collects the current temperature data of the mobile terminal casing, the current temperature data T1 i...

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Abstract

A device and method for adjusting the shell temperature of a mobile terminal. The device includes a thermoelectric cooler and a pulse modulator. The thermoelectric cooler is formed by repeated arrangement and series connection of at least one pair of semiconductor couples, and the pair of semiconductor couples is installed on Between the two ceramic substrates, the first ceramic substrate is in contact with the heat-generating components of the mobile terminal, and the second ceramic substrate is in close contact with the casing of the mobile terminal or the second ceramic substrate is used as the casing of the mobile terminal; the two thermoelectric coolers The terminal is connected to an H bridge, and the input terminals of the H bridge are respectively connected to the output terminals of the pulse modulator; and a thermal sensitive element arranged on the second ceramic substrate is also included, and the thermal sensitive element is connected with a PID control circuit through a PID control circuit. The pulse modulator is electrically connected. The invention fully utilizes the advantage of high local heat dissipation efficiency of the thermoelectric cooler, and the cooling power is adjustable, cooling and heating can be switched, the structure is simple, and the cost is low; the temperature of the contact end between the thermoelectric cooler and the human body is controlled by a circuit, and user experience is improved.

Description

technical field [0001] The present invention relates to electronic equipment, in particular to a device and method for adjusting the temperature of a casing of a mobile terminal. Background technique [0002] As more and more modules are embedded in smart phones, the frequency of chips used is higher and higher, and the thickness of mobile phones is getting thinner and thinner, the heating problem of mobile phones has become a technical problem for technology developers, which has not been effectively solved. Many models are accompanied by severe fever when doing a large amount of data processing, which directly affects the user experience. [0003] The existing mobile phone temperature adjustment mechanism is mainly aimed at the heat dissipation inside the mobile phone. By setting a cooling fan, the wind blown by the fan will take away the heat generated by the mobile phone, or set a heat conduction sheet to guide the heat generated by the power supply or motor to the casin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04M1/02
Inventor 贺驰光
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD