EMD (empirical mode decomposition)-based stress-strain reconstruction method

An empirical mode decomposition and stress-strain technology, which is applied in the testing of machine/structural components, measuring devices, instruments, etc., to achieve the effect of fast analysis speed and high accuracy

Inactive Publication Date: 2015-10-21
BEIHANG UNIV
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Problems solved by technology

[0004] Aiming at the existing problem that the strain and stress in fatigue crack growth cannot be directly measured, the present invention provides a stress-strain reconstruction method based on empirical mode decomposition, which reconstructs the stress-strain of key unmeasurable points, and is suitable for evaluating structures Estimation of stress loading history of damage during fatigue damage life of parts

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  • EMD (empirical mode decomposition)-based stress-strain reconstruction method
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  • EMD (empirical mode decomposition)-based stress-strain reconstruction method

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[0019] The stress-strain reconstruction method provided by the present invention is described in detail below in conjunction with examples.

[0020] The invention discloses a stress-strain reconstruction method based on Empirical Mode Decomposition (EMD), which is mainly based on three aspects of information: measurement data of strain gauges, structural models, and position information of measurable points and unmeasurable points. The present invention decomposes the measured structural response of the monitoring system or the measurable point of the sensor into a group of modal responses by using EMD, and can obtain the modal between the measurable point and the key point that cannot be directly measured by establishing a conversion formula based on the finite element model Response relationship, so as to obtain a set of modal responses of unmeasurable points, and the structural response of unmeasurable points can be reconstructed by superimposing the obtained modal responses...

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Abstract

The invention provides an EMD (empirical mode decomposition)-based stress-strain reconstruction method and belongs to the technical field of structural health monitoring. The method is mainly based on the information of three aspects of measured data of a strain gauge, a structural model, and the position information of measurable points and immeasurable points. The method comprises the steps of decomposing the actual measurement structural response of the measurable points of a monitoring system or a sensor into a group of modal responses; obtaining the modal response relationship between the measureable points and the immeasurable key points by establishing a finite element model-based conversion equation to obtain a group of modal responses of the immeasurable points and reconstructing the structural responses of the immeasurable points by superposing the obtained modal responses. The method enables the strain gauge to be directly used for measurement of the stress-strain of the key points under the condition of no direct sensor measurement, and is high in accuracy and analysis speed.

Description

technical field [0001] The invention belongs to the technical field of structural health monitoring, and in particular relates to a stress-strain reconstruction method based on empirical mode decomposition (EMD) of key unmeasurable points. Background technique [0002] Structural health monitoring (SHM) is a key issue in engineering systems, civil infrastructure, and smart structures in recent years. For most mechanical systems subjected to fatigue loading, fatigue crack growth is a major failure path, and fatigue damage mainly depends on the stress loading history under actual working conditions. The difficulty of fatigue life prediction is that it is difficult to infer the stress and fatigue load near the fatigue crack. Since the location of the damage is unknown, it is difficult to directly measure the stress or strain at the damage site. Therefore, inferring the stress and strain field at the hazard point from the measurement data at a remote location becomes an essent...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01M99/00
Inventor 何晶靖周艺斌张卫方刘晓鹏韩大利王邓江阳劲松
Owner BEIHANG UNIV
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