Method of making a stacked package

Abstract

A stacked package and its manufacturing method, the package comprising: a first surface and a second surface opposite to each other, a first side surface and a second side surface opposite to each other connecting the first surface and the second surface, and A first substrate with a plurality of first electrical connection pads; a chip electrically connected to the first surface; connected to the first surface of the first substrate and having opposite third and fourth surfaces , the second substrate connecting the third surface and the fourth surface and the opposite third side surface and the fourth side surface, a plurality of second electrical connection pads, the distance between the third side surface and the fourth side surface 15 to 3900 microns smaller than the distance between the first side surface and the second side surface; and corresponding to a plurality of interconnection structures electrically connecting the first electrical connection pad and the second electrical connection pad. The invention can improve the cleaning effect of the cleaning device and reduce the damage probability of the second substrate caused when cutting the first typesetting structure.

Description

technical field [0001] The invention provides a stacked package and its manufacturing method, in particular to a stacked package with different substrate areas on the upper and lower layers and its manufacturing method. Background technique [0002] Due to the popularity of portable electronic devices, more and more electronic devices need to be light, thin and compact, especially for semiconductor components and their packaging structures, which are constantly pursuing smaller and thinner designs. Therefore, the technology of stacked packages is also thereby flourishing. [0003] Please refer to Figure 1A and Figure 1B , which is a cross-sectional view of an existing stacked package with the same upper and lower substrate areas, where, Figure 1A and Figure 1B The stacked package includes a first substrate 10, a chip 13, a second substrate 30, and a plurality of interconnect structures 15, and also includes a primer 14 and an insulating protective layer 17. The area of...

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Problems solved by technology

[0009] Please refer to Figure 1B , because in another existing manufacturing process embodiment of a stacked package, the singulated second substrate 30 is placed on the first substrate 10 that is still formed into a layout structure, and the first substrate 10 and the second substrate 30 The first encapsulant 16 is formed between them. When cutting the typesetting structure with the cutter 6, if the area of ​​the upper and lower substrates is the same, the cutter 6 will easily contact the second substrate 30, thereby forming a moment on the second substrate 30, damage the second substrate 30

[0010] Therefore, how to overcome the problem that the cleaning effect of the existing stacked package with the same area of ​​the upper and lower substrates is hindered by the upper substrate and reduce the cleaning effect, and how to overcome the problem that the second substrate is affected by the tool when cutting the layout structure. The problem of damage caused by applying force is actually a big problem for those skilled in the art

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