Rigid-flex printed circuit board milling method

A technology of rigid-flex boards and milling boards, applied in the direction of electrical components, printed circuit manufacturing, printed circuits, etc., can solve problems such as rough edges of the shape, failure to solve problems effectively, and little effect, and achieve rough board edges, The effect of solving the residual burr on the soft board

Inactive Publication Date: 2015-11-11
SHENZHEN KINWONG ELECTRONICS
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Problems solved by technology

But neither of these two methods effectively solve the problem
The board punching method will lead to rough edges of the shape; if the optical core board is placed on the surface of the soft board, since the optical core board and the soft board are not tightly bonded, the effect is not great, and the soft board still has burrs.

Method used

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  • Rigid-flex printed circuit board milling method

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Embodiment Construction

[0017] The present invention provides a method for milling a rigid-flexible plate. In order to make the purpose, technical solution and effect of the present invention clearer and clearer, the present invention will be further described in detail below. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0018] A method for milling a rigid-flex board provided by the present invention comprises the steps of:

[0019] S101, paste a layer of tape on one side of the soft board of the rigid-flex board, the thickness of the tape is between 0.025mm and 0.5mm;

[0020] S102. Use roller pressing method to make the adhesive tape and soft board closely fit, and the pressure of the pressing roller is 0.5~4kg / cm 2 ;

[0021] S103, milling the shape of the rigid-flex board, and tearing off the tape after milling the shape.

[0022] Such as figure 1 As shown, from bottom to top are the ...

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Abstract

The invention discloses a rigid-flex printed circuit board milling method. the method comprises steps: A, a layer of adhesive tape with the thickness between 0.025mm to 0.5mm is attached to the flexible face of the rigid-flex printed circuit board; B, a roller pressing mode is used for enabling the adhesive tape and the flexible face to be tightly attached, wherein the pressing roller has a pressure of 0.5 to 4kg/cm2; and C, board milling and gong appearance shaping are carried out on the rigid-flex printed circuit board, and after milling and shaping, the adhesive tape is removed. As the adhesive tape is attached to the flexible face, the roller pressing mode is used for pressing to enable the adhesive tape and the flexible face to be tightly attached, board milling and gong appearance shaping are carried out in a conventional board milling mode, and finally the adhesive tape is removed, the problems of rough board edges and flexible board burr remaining can be effectively solved.

Description

technical field [0001] The invention relates to the technical field of PCB production, in particular to a method for milling rigid-flexible boards. Background technique [0002] The rigid-flex board has changed the traditional planar design concept and expanded it to a three-dimensional three-dimensional space concept. While bringing great convenience to product design, it also brings great challenges. Designers of rigid-flex boards can use a single component to replace a composite printed circuit board connected by multiple connectors, multiple cables, and ribbon cables, with stronger performance and higher stability, while also reducing the scope of the design. Confined within a component, the available space is optimized by bending and folding lines like a paper swan, and rigid-flex boards have been used more and more in recent years. However, for the rigid-flex board on the outer layer of the soft board, the PI material of the soft board is easy to remain in the milling...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/0044H05K1/147H05K2203/0228
Inventor 陈晓宇王俊候利娟
Owner SHENZHEN KINWONG ELECTRONICS
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