Grinding pad fixing device and chemical machinery grinder

A technology of fixing device and grinding pad, applied in the direction of grinding tools, etc., can solve the problems of high scrap rate of grinding pads, reduce production costs, etc., and achieve the effect of ensuring service life, preventing deformation, and ensuring grinding accuracy

Inactive Publication Date: 2015-11-18
WUHAN XINXIN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a polishing pad fixing device and a chemical mechanical polishing device to solve the problem of high scrapping rate of polishing pads caused by frequent replacement of polishing pads in the prior art and reduce production costs

Method used

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  • Grinding pad fixing device and chemical machinery grinder
  • Grinding pad fixing device and chemical machinery grinder
  • Grinding pad fixing device and chemical machinery grinder

Examples

Experimental program
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Effect test

Embodiment 1

[0032] refer to figure 2 , the grinding pad fixing device 300 of the present embodiment includes a grinding platform 310, a vacuum system 320 and a substrate 330, wherein the vacuum system 320 is connected to the grinding platform 310, so that the upper surface of the grinding platform 310 is formed as a vacuum adsorption surface. , the bottom of the substrate 330 is vacuum-adsorbed on the upper surface of the polishing platform 310 , and the back surface of the polishing pad 400 is fixed on the upper portion of the substrate 330 . Then, when the grinding pad 400 needs to be replaced, it is only necessary to remove the substrate 330 and the grinding pad 400 from the grinding platform 310 as a whole, and then the substrate 330 and the grinding pad 400 can be placed as a whole and kept moist for use for Use it next time.

[0033] The inventor considers that the material of the grinding pad 400 is relatively soft. If the grinding pad 400 is directly vacuum-adsorbed on the grind...

Embodiment 2

[0051] This embodiment provides a chemical mechanical polishing device, including a polishing pad, a polishing head disposed above the polishing pad and used for grinding wafers, and the polishing pad fixing device described in Embodiment 1, the polishing pad fixing device can be used For fixed abrasive pads, see Figure 8 .

[0052] Such as Figure 8 As shown, the chemical mechanical polishing apparatus 500 of this embodiment includes a polishing pad 510 , a substrate 520 , a polishing platform 530 , a polishing head 540 and a vacuum system 550 . The vacuum system 550 includes a vacuum pipeline 551 connected to the grinding platform 530 and a vacuum pump 552 connected to the vacuum pipeline 551 . The substrate 520 is disposed between the polishing pad 510 and the polishing platform 530 , and is vacuum-adsorbed on the upper surface of the polishing platform 530 . The polishing pad 510 is fixed on the upper portion of the substrate 520 , and the polishing head 540 is dispose...

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PUM

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Abstract

The invention provides a grinding pad fixing device and a chemical machinery grinder; the grinding pad fixing device comprises a vacuum system connected with a grinding platform and a substrate absorbed on the grinding platform in a vacuum manner; the grinding pad is fixed on the substrate. The grinding pad fixing device uses the grinding platform connected with the vacuum system, so a vacuum absorption surface is formed on the top surface of the grinding platform; the substrate adsorbed on the grinding platform through vacuum can fix the grinding pad on the grinding platform; when the grinding pad needs to be replaced, the substrate and the grinding pad can be integratedly dismounted from the grinding platform without damaging the grinding pad, thus ensuring the lift of the grinding pad; when the grinding pad is fixed, the grinding pad can be fixed without having deformation caused by improper fixation, thus ensuring grinding precision.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a polishing pad fixing device and a chemical mechanical polishing device. Background technique [0002] In the wafer manufacturing process, with the increase of integration and the reduction of semiconductor device process size, photolithography technology has higher and higher requirements for the flatness of the wafer surface. Among them, chemical mechanical polishing (CMP, ChemicalMechanicalPolishing) It is a common process method used to planarize the surface of the wafer, which is a processing technology that combines chemical corrosion and mechanical removal. Because CMP can more accurately and uniformly grind the wafer to the required thickness and flatness, it plays an increasingly important role in the semiconductor device manufacturing process. [0003] In the CMP process, the surface of the wafer is usually planarized by chemical mechanical polishing equipment,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/11
CPCB24B37/11
Inventor 余俊磊
Owner WUHAN XINXIN SEMICON MFG CO LTD
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