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Die cutting material seam splicing processing process and die cutting product thereof

A processing technology, die-cutting technology, applied in metal processing and other directions, to achieve the effect of improving utilization rate and avoiding waste

Active Publication Date: 2015-11-18
北京华懋伟业精密电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a seam splicing process of die-cut materials and die-cut products thereof, so as to solve the aforementioned problems in the prior art

Method used

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  • Die cutting material seam splicing processing process and die cutting product thereof
  • Die cutting material seam splicing processing process and die cutting product thereof
  • Die cutting material seam splicing processing process and die cutting product thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] An embodiment of the present invention provides a seam splicing process for die-cut materials, including the following steps:

[0029] S1, preparing horizontal upper and lower frame materials and vertical frame materials;

[0030] S2. Die-cut the inner contours of the horizontal upper and lower frames and the concave interface parts of the horizontal upper and lower frame materials, and the concave interface parts are located on the left and right sides of the horizontal upper and lower frames; mold the vertical frame materials Cutting out the inner contour of the longitudinal frame and the convex interface part, the convex interface part cooperates with the concave interface part, and the convex interface part is located on the upper and lower sides of the longitudinal frame;

[0031] S3, using the asynchronous bonding function of the device to splice the vertical frame and the horizontal upper and lower frames through the occlusal relationship between the convex inter...

Embodiment 2

[0050] An embodiment of the present invention provides a die-cut product, which is manufactured by using the die-cut material seam splicing process described in Embodiment 1.

[0051] The seam splicing process of the die-cut material has been discussed in detail in Embodiment 1, and will not be repeated here.

[0052] In the embodiment of the present invention, the die-cut product is an annular narrow frame product.

[0053] And the profile size of the die-cut product is greater than or equal to 30mm*30mm.

[0054] The die-cut products obtained by adopting the die-cutting process provided in this embodiment can greatly save materials.

[0055] Due to the different sizes of the products, the spacing between the frames is different, and the effect of saving materials is also different. Taking the test as an example, the product specification is 134mm*65mm, and the horizontal inner frame area is 111mm*63mm by using the traditional die-cutting process. , and such a large area of...

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Abstract

The invention discloses a die cutting material seam splicing processing process and a die cutting product thereof and relates to the technical field of adhesive piece die cutting in the electron industry. The processing process comprises the steps that an upper transverse frame, a lower transverse frame and a longitudinal frame are processed respectively, the longitudinal frame is spliced on the transverse frames through the asynchronous fit function of equipment, and therefore raw materials needed by an annular product are prevented from generating inner contour waste materials during die cutting. When the materials are spliced, the shapes of the inner frames are formed, and then the appearance of the product is processed through a traditional die cutting technology. The whole process is automatically completed through circular knife or anvil blade die cutting equipment. According to the die cutting material seam splicing processing process, only normal surrounding edge waste materials are generated in the die cutting process, waste materials of the inner frame area are not generated, and therefore the utilization rate of the materials is improved and material waste is avoided.

Description

technical field [0001] The invention relates to the technical field of die-cutting adhesive parts in the electronics industry, in particular to a seam splicing process of die-cut materials and die-cut products thereof. Background technique [0002] The die-cutting process is a forming process in which a die-cutting knife is used to form a die-cutting plate according to the pattern required by the product design, and under the action of pressure, the tape or other plate-like blanks are rolled and cut into the desired shape or cut. [0003] At present, the die-cutting process generally includes two processes for ring products: one is to cut out the inner and outer rings of the product at one time, and the other is to cut the inner and outer rings separately. The above two processes all have the following problem: the material in the inner contour of the entire annular product will be wasted. Contents of the invention [0004] The object of the present invention is to provid...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B26F1/38B26D7/27
Inventor 李毓龙
Owner 北京华懋伟业精密电子有限公司