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Manufacturing device for waterproof case of electronic equipment and process using the same

A technology for manufacturing devices and waterproof casings, applied in the field of waterproof casings for electronic equipment, can solve the problems of high process cost and low efficiency, and achieve the effect of low process cost and high production efficiency

Active Publication Date: 2018-01-23
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is that the two-shot molding machine in the prior art includes two sets of molds, which require two moldings to obtain the electronic equipment casing, which has high process cost and low efficiency; Device for manufacturing waterproof casings

Method used

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  • Manufacturing device for waterproof case of electronic equipment and process using the same
  • Manufacturing device for waterproof case of electronic equipment and process using the same
  • Manufacturing device for waterproof case of electronic equipment and process using the same

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Embodiment Construction

[0056] The manufacturing device of the waterproof casing of electronic equipment according to the present invention includes an upper template 1 and a lower template 2 arranged oppositely, and the shape and size of the upper template 1 and the lower template 2 can be selected according to needs. In this embodiment, The cross-sections of the upper template 1 and the lower template 2 are rectangular, and the size of the upper template 1 and the lower template 2 are the same; the support plate 3, the support plate 3 is arranged on the top of the lower template 2, and the The lower formwork 2 is detachably connected, the upper formwork 1 is detachably arranged above the support plate 3, the upper formwork 1 is suitable for fastening with the support plate 3, and the shape and size of the support plate 3 It can be selected according to needs. In this embodiment, the shape and size of the support plate 3 are the same as those of the upper formwork 1 and the lower formwork 2 .

[005...

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Abstract

The invention discloses a manufacturing apparatus for an electronic-equipment waterproof housing. The manufacturing apparatus comprises an upper die plate and a lower die plate which are arranged in an opposite way, a supporting plate and an injection channel; the supporting plate is arranged at the top of the lower die plate, the upper die plate is arranged above the supporting plate and is suitable for being buckled with the supporting plate; under the buckling state, the space between the upper die plate and the supporting plate forms a base-material space suitable for laying a base material, and also the space between the upper die plate and the base-material space forms a sealing-material injection chamber suitable for injecting a sealing material on the base material surface for molding; one end of the injection channel is communicated with the interior of the sealing-material injection chamber, and the other end of the injection channel extends outside of the manufacturing apparatus; in the relative compacting process of the upper die plate and the lower die plate, the sealing-material injection chamber is suitable for enabling the sealing material to be fixed and molded on the base material surface. The invention also discloses a technology of using the apparatus to manufacture the waterproof housing. The apparatus is capable of manufacturing an electronic-equipment waterproof housing with a sealing ring in a one shot forming manner by employing a set of die, technological cost is low and production efficiency is high.

Description

technical field [0001] The invention relates to a manufacturing device for a waterproof casing of electronic equipment and a process for manufacturing the casing using the device, belonging to the technical field of waterproof casings for electronic equipment. Background technique [0002] When notebooks, tablet computers, mobile phones and other types of electronic equipment are in a humid environment, the electronic components inside are easily damaged, so electronic equipment is generally equipped with a waterproof casing. In terms of the material of the waterproof case, since metal materials are prone to oxidation and electrochemical corrosion, the current waterproof case mostly uses a plastic substrate, and in order to ensure the tightness of the waterproof case, rubber is further bonded to the edge of the waterproof case. Sealing materials to isolate the external environment and the component body in the electronic device; considering factors such as the firmness of th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C70/34B29C70/54
Inventor 兰品双毛定文张晓东
Owner BYD CO LTD