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Semiconductor device mounting structure, backlight device, and mounting substrate

A technology for mounting substrates and semiconductors, which is applied to semiconductor devices, components of lighting devices, lighting devices, etc., to achieve the effect of improving yield

Active Publication Date: 2018-11-13
NICHIA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] The present invention is established in order to solve the existing problems

Method used

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  • Semiconductor device mounting structure, backlight device, and mounting substrate
  • Semiconductor device mounting structure, backlight device, and mounting substrate
  • Semiconductor device mounting structure, backlight device, and mounting substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0083] A perspective view of the semiconductor light emitting device 1 according to Embodiment 1 of the present invention is as follows: figure 1 As shown, the horizontal section of the line II-II is shown in figure 2 shown. The semiconductor light emitting device 1 shown in these figures includes a base 4 extending in one direction, and a sealing member 7 protruding from the base 4 . By protruding the sealing member 7 from substantially the center of the base body 4, the outer shape of the semiconductor light emitting device 1 is formed into a substantially convex shape. External connection terminals 3 are disposed on both ends of the base body 4 in the longitudinal direction. These external connection terminals 3 are exposed on the surface of the semiconductor light emitting device 1, such as Figure 3A What is shown is an electrical connection terminal when the semiconductor light emitting device 1 is mounted on a mounting substrate 51 to be described later.

[0084] ...

Embodiment approach 2

[0110] In addition, in the above example, an example was shown in which the linear region of the external connection terminal was formed in a U-shape which is a rectangle with one opening, but the present invention is not limited to this form. For example, the linear region may be composed of two parallel sides instead of three consecutive sides. This example is shown as Embodiment 2 in the plan view of FIG. 14 . In this example, external connection terminals 3B are respectively provided on the inside, front side, and rear side of the side surfaces of the semiconductor light emitting device 1B. The pair of external connection terminals 3B are electrically connected through through holes (holes, through holes) or the like formed in the base body 4 . In the linear region 32B formed by such a plurality of separated sides, the device-side mounting insulating region 34 surrounded by such a linear region 32B can also be formed to correspond to the pad-side insulating region 54 form...

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Abstract

A semiconductor device mounting structure, a backlight device, and a mounting substrate. The mounting structure of a semiconductor device according to the present invention has: a semiconductor device having external connection terminals respectively arranged at both ends in the longitudinal direction; There is a metal area on the mounting surface, and a device-side mounting insulating area is provided in the area defined by the metal area. The mounting substrate has a land pattern formed of a conductor on the insulator on the mounting surface side for connecting external connection terminals. The pattern is formed in a size to surround the end of the semiconductor device, and an insulating region along the device side mounting insulating region, that is, a pad side insulating region is formed.

Description

[0001] This application claims priority from Japanese Patent Application No. 2014-105,046 filed on May 21, 2014. Its entire content is hereby incorporated by reference. technical field [0002] The present invention relates to a mounting structure of a semiconductor device, a backlight device, and a mounting substrate. Background technique [0003] Currently, various light sources are used in electronic equipment, for example, a side-view light emitting device is used as a backlight light source of a display panel of the electronic equipment. Such a light-emitting device includes a substrate and a light-emitting element. The substrate has a chip-shaped base material having a concave portion, and a set of terminals formed on the surface of the base material and connected to the light-emitting element. Furthermore, as a substrate, a configuration in which a set of terminals extending from below the light-emitting element is respectively provided around the surfaces near both ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21V19/00H01L33/48H05K3/34
CPCH05K3/3442H05K2201/09381H05K2201/09427H05K2201/09745H05K2201/10106H05K2201/10454H05K2203/048H05K1/111Y02P70/50G02B6/0073G02B6/0066H05K1/181H05K2201/09472
Inventor 中林拓也堀彰良
Owner NICHIA CORP