Conversion card for testing probe card

Abstract

Provided is a conversion card for testing a probe card. The conversion card comprises a plate body, and a plurality of first transmission units, a plurality of second transmission units and a DC / AC conversion circuit; and the first transmission units, the second transmission units and the DC / AC conversion circuit are disposed on the plate body. The first transmission units are electrically connected with a test instrument. The second transmission units are electrically connected with interfaces of the probe card. The DC / AC converting circuit is electrically connected with the first transmission units and the second transmission units. AC signals are transmitted by the first transmission units, and the AC signals are transmitted to the DC probe card through the DC / AC conversion circuit, the second transmission units and the interfaces of the probe card. By using principles of an AC circuit and a transmission line, the conversion card cooperates with AC signal test instruments of a logic analyzer, an oscilloscope, a time-domain reflectometer, a frequency domain network analyzer, an error code generator, an eye pattern analyzer and the like. An AC method is used to perform error analysis and improvement on the DC probe card, thereby preventing the misjudging error rate of the probe card, reducing the card changing rate and the pin removing rate, and reducing the inventory ratio of the DC probe card.

Description

technical field [0001] The invention relates to a conversion card, in particular to a conversion card for testing probe cards. Background technique [0002] For a long time, the semiconductor industry will first verify whether the DC probe card (ProbeCard) is available during the wafer reliability test (wafer acceptance test), because the DC probe card is responsible for the final stage of the test, before the IC is cut (WS: WaferSort ), the important role of whether the functional test is normal. When the IC test can work normally, the IC will be cut and packaged (FT: FinalTest; IChasbeenpackaged) and then followed by the classification (BIN) test. It can be seen that when the DC probe When the error rate of the card is high, it will directly affect the speed and quality of the subsequent shipments. However, as the IC function becomes stronger and stronger, the number of pins of the DC probe card increases, even as high as tens of thousands of pins. It costs tens of millio...

AI Technical Summary

Problems solved by technology

[0002] For a long time, the semiconductor industry will first verify whether the DC probe card (ProbeCard) is available during the wafer reliability test (wafer acceptance test), because the DC probe card is responsible for the final stage of the test, before the IC is cut (WS: WaferSort ), the important role of whether the functional test is normal. When the IC test can work normally, the IC will be cut and packaged (FT: FinalTest; IChasbeenpackaged) and then followed by the classification (BIN) test. It can be seen that when the DC probe When the error rate of the card is high, it will directly affect the speed and quality of the subsequent shipments. However, as the IC function becomes stronger and stronger, the number of pins of the DC probe card increases, even as high as tens of thousands of pins. It costs tens of millions. If the DC probe card is judged to have a high error rate, it is necessary to clear the needle or even replace the card. These actions are very costly and time-consuming. Fabs and test factories often rush to deliver goods to customers. Often the card is replaced directly until the test is correct, and the cost of these replaced DC probe cards is directly absorbed by the fab and the test factory, so the inventory rate of DC probe cards often reaches several thousand Taiwan dollars Tens of thousands to hundreds of millions of grades, resulting in a substantial increase in costs

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