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Resistive memory and operating method therefor

A technology of resistive memory and resistive storage, which is applied in the field of memory, and can solve problems affecting the operation efficiency of traditional resistive memory, erasing failure, and erasing current drop.

Inactive Publication Date: 2015-11-25
MACRONIX INT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the traditional resistive memory is erased, the body effect of the transistor (BodyEffect) will cause the erase current I r Decrease, which in turn affects the operating efficiency of traditional resistive memory, and easily causes erase failure accidents

Method used

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  • Resistive memory and operating method therefor
  • Resistive memory and operating method therefor
  • Resistive memory and operating method therefor

Examples

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no. 1 example

[0041] Please also refer to figure 1 , figure 2 and image 3 , figure 1 is shown as a schematic diagram of a memory cell of a resistive memory according to the first embodiment, figure 2 is shown as a schematic diagram of a programming resistance memory cell, image 3 A schematic diagram of an erase resistance memory cell is shown. The memory cell 11 includes a resistive memory cell Rcell, a main transistor TM and an auxiliary transistor TA. The drains of the main transistor TM and the auxiliary transistor TA are coupled to the resistance storage unit R cell one end. Resistance memory cell R cell The other end of is coupled to the corresponding drain line. The gate of the main transistor TM is coupled to the corresponding main gate line, and the gate of the auxiliary transistor TA is coupled to the corresponding auxiliary gate line. The gate voltage applied to the main gate line can be adjusted according to the position of the main gate line. Similarly, the gate ...

no. 2 example

[0051] Please also refer to Figure 9 and Figure 10 , Figure 9 is shown as a circuit diagram of a resistive memory according to the second embodiment, Figure 10 It is a circuit layout diagram of the resistive memory according to the second embodiment. The aforementioned drain line is Figure 9 Take the drain lines DL1~DL3 as an example, and the aforementioned source lines are Figure 9 The source lines SL1 - SL4 are taken as an example for illustration. The aforementioned main gate line is Figure 9 Take the main gate lines GL1~GL3 as an example, and the aforementioned auxiliary gate lines are Figure 9 The auxiliary gate lines GL1A˜GL3A are taken as an example for illustration. The resistive memory 2 includes memory cells 11 , drain lines DL1 - DL3 , main gate lines GL1 - GL3 , auxiliary gate lines GL1A - GL3A and source lines SL1 - SL4 . The drain lines DL1 - DL3 , the main gate lines GL1 - GL3 , the auxiliary gate lines GL1A - GL3A and the source lines SL1 - SL4 ...

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Abstract

The present invention discloses a resistive memory and an operating method therefor. The resistive memory comprises a resistive storage unit, a main transistor and an auxiliary transistor. The drains of the main transistor and the auxiliary transistor are coupled to one end of the resistive storage unit. when the resistive storage unit is programmed, the main transistor is turned on, and the auxiliary transistor is turned off. When the resistive storage unit is erased, the main transistor and the auxiliary transistor are turned on.

Description

technical field [0001] The present invention relates to a memory, and in particular to a resistive memory and its operating method. Background technique [0002] Please refer to Figure 14 and Figure 15 , Figure 14 Illustrated as a schematic diagram for programming a conventional resistive memory, Figure 15 A schematic diagram of erasing a conventional resistive memory is shown. The basic structure of traditional resistive memory 3 is based on a transistor T and a resistive storage unit R cell composed of. The structure of the resistive memory 3 itself is a metal / insulator / metal (MIM) structure. Resistive memory 3 changes the resistance storage unit R by applying an external bias voltage cell resistor value to perform programming and erasing actions. [0003] Such as Figure 14 shown, when programming the memory cell with resistor R cell , the gate of the transistor T and the resistance storage unit R ceu A bias of +V is applied, and the source of transistor T is ...

Claims

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Application Information

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IPC IPC(8): G11C13/00H01L45/00
Inventor 李明修
Owner MACRONIX INT CO LTD