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Organic light-emitting diode display panel and packaging method thereof, and display device

A technology of light-emitting diodes and display panels, applied in organic light-emitting devices, organic light-emitting device manufacturing/processing, organic semiconductor devices, etc., can solve the problems of difficult large-size display device packaging, high stress, easy cracking, etc., and achieve narrow borders Effects of design, avoiding cracking problems, and improving production efficiency

Active Publication Date: 2015-12-16
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Among them, the sealability of UV glue packaging technology is poor, and it is difficult to guarantee the life expectancy of OLED devices; the packaging technology combined with UV glue and desiccant cannot meet the production needs of top-emitting devices; and the sealing material packaging technology faces high stress and is easy to crack. problems, and it is difficult to package large-size display devices

Method used

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  • Organic light-emitting diode display panel and packaging method thereof, and display device
  • Organic light-emitting diode display panel and packaging method thereof, and display device
  • Organic light-emitting diode display panel and packaging method thereof, and display device

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Embodiment Construction

[0057] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0058] Embodiments of the present invention firstly provide a packaging method for an organic light emitting diode display panel, the organic light emitting diode display panel includes a first substrate to be packaged and a second substrate, such as figure 1 As shown, the encapsulation method includes the following steps:

[0059] S1. Forming a first bonding layer on the packaging area of ​​the first substrate, and forming a second bonding layer on the packaging area of ​​the second substrate, where the packaging area of ​​the first substrate corresponds to the packaging area of ​​the second substrate;

[0060] S2 , aligning the first substrate and the second ...

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Abstract

The invention discloses an organic light-emitting diode display panel and a packaging method thereof, and a display device and belongs to the technical field of display. The organic light-emitting diode display panel comprises a first substrate and a second substrate to be packaged. The packaging method comprises steps of forming a first bonding layer on a packaging zone of the first substrate, and forming a second bonding layer on a packaging zone of the second substrate; and subjecting the first substrate and the second substrate to box aligning so as to link molecules in the first bonding layer and molecules in the second bonding layer, thereby packaging the first substrate and the second substrate. The invention utilizes the bonding technology to package two substrates of the organic light-emitting diode display panel, and achieves good sealing and structure stability. In addition, the light emitting diode cannot be destroyed in the packaging process, and the edge next to the light emitting material is packaged to facilitate the narrow frame design of products.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to an organic light emitting diode display panel, a packaging method thereof, and a display device including the organic light emitting diode display panel. Background technique [0002] Organic light-emitting diode (OLED) display technology, as the most promising flat panel display technology, has many advantages such as high contrast, thin thickness, wide viewing angle, and no need for backlight. Correspondingly, the encapsulation technology of OLED panel has always been a research hotspot in the field of OLED display. [0003] At present, the mainstream OLED packaging technologies mainly include ultraviolet glue (UV glue) packaging technology, UV glue and desiccant combined packaging technology, sealing material (Frit) packaging technology, etc. Among them, the sealability of UV glue packaging technology is poor, and it is difficult to guarantee the life expectancy of O...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/32H01L51/52H01L51/56
CPCH10K59/12H10K50/8426H10K71/00H10K50/841H10K50/846H10K50/8423H10K50/8428H10K50/8445H10K2102/00H10K2102/351B32B2457/206
Inventor 许正印
Owner BOE TECH GRP CO LTD