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RF Module

A frequency band and signal technology, applied in baseband systems, digital transmission systems, electrical components, etc., can solve problems such as power loss, large RF module size, and reduced duplexer efficiency, reducing path loss, miniaturizing the overall circuit, cost reduction effect

Inactive Publication Date: 2015-12-23
LG INNOTEK CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, a matching circuit provided between such components increases the path loss of the RF module because of the transmission line connected between the matching circuits
Therefore, the following problems occur: the received power is lost, or the sensitivity of the transmitted signal is reduced
[0004] In addition, there are other issues: processing costs may increase due to integration of components, and the size of RF modules may also become larger
Also, EMI (Electromagnetic Interference) that occurs due to interference between components may not be controllable
[0005] In addition, the efficiency of duplexers may be reduced due to phase shifts in the matching circuits in the transmission line
Therefore, there is also a risk that the reception characteristics may not be maintained in the load

Method used

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Embodiment Construction

[0031] Various exemplary embodiments are described more fully hereinafter with reference to the accompanying drawings, in which some exemplary embodiments are shown. However, inventive concepts may be embodied in many different forms and should not be construed as limited to the exemplary embodiments set forth herein. Rather, the described aspects are intended to cover all such alterations, modifications, variations and equivalents as fall within the scope and novel concepts of the present disclosure.

[0032] Although various exemplary embodiments may be more fully described using words including ordinal numbers such as 'first' and 'second', such components are not limited to the above terms. The above terms are only used to distinguish one component from another.

[0033] When a component is referred to as being "connected" to or "accessing" another component, this may mean that it is directly connected to or intervenes with the other component, but it should be understood ...

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PUM

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Abstract

The invention relates to a RF module. The invention discloses an embodiment. The RF module includes a first FEM configured to bypass a signal in a first band, and to block a signal in a second band; and a second FEM configured to block a signal in a first band, and to bypass a signal in a second band.

Description

technical field [0001] The present disclosure relates to an RF (Radio Frequency) module. Background technique [0002] Generally, an RF module configured to receive RF (Radio Frequency) signals having frequencies in at least two frequency bands connects RF signals corresponding to frequencies in different frequency bands by arranging a duplexer at the rear end of its antenna. The path is electrically separated. [0003] However, a matching circuit provided between such components increases the path loss of the RF module because of the transmission lines connected between the matching circuits. Therefore, there arises a problem that the received power is lost, or the sensitivity of the transmission signal is lowered. [0004] In addition, there are other problems: the processing cost may increase due to the integration of components, and the size of the RF module may also become larger. Furthermore, EMI (Electromagnetic Interference) occurring due to interference between c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04B1/40
CPCH04B1/525H04L25/0278
Inventor 金宥宣
Owner LG INNOTEK CO LTD