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Data center 3D modeling method and device

A data center and modeling method technology, applied in 3D modeling, image data processing, special data processing applications, etc., can solve problems affecting the delivery of micro-module monitoring products, shorten the delivery cycle, and improve development efficiency.

Active Publication Date: 2015-12-30
ZTE CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such a process is repetitive and cumbersome, and involves multiple roles, which delays the development cycle and ultimately affects the delivery of micro-module monitoring products

Method used

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  • Data center 3D modeling method and device
  • Data center 3D modeling method and device
  • Data center 3D modeling method and device

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Experimental program
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Embodiment Construction

[0030] In the embodiment of the present invention, a 2-dimensional micro-module plane model is established according to the substructure included in the micro-module, and the first structural data of the micro-module plane model is obtained; a 2-dimensional second micro-module is established according to the micro-module contained in the first space. A spatial planar model, obtaining the second structure data of the first spatial planar model, performing 3D modeling on the substructure in the micro-module planar model, obtaining a 3D submodule corresponding to the substructure, according to the first The structural data and 3D sub-module construct the 3D model of the micro-module, import the 3D model of the micro-module into the first space plane model according to the second structural data to form a 3D model of the data center, and output the 3D model of the data center.

[0031] The present invention will be further described in detail below with reference to the accompanyin...

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Abstract

The invention discloses a data center 3D modeling method. The method includes the following steps that: 2-dimensional micro module plane models are built according to sub structures contained in micro modules, and the first structure data of the micro module plane models are obtained; a 2-dimensional first spatial plane model is built according to micro modules contained in a first space, and the second structure data of the first spatial plane model are obtained, and 3D modeling is performed on the sub structures in the micro module plane models, so that 3D sub modules corresponding to the sub structures can be obtained, and 3D models of the micro modules are built according to the first structure data and the 3D sub modules, and the 3D models of the micro modules are introduced to the first spatial plane model according to the second structure data, so that a data center 3D model can be formed, and the data center 3D model is outputted. The invention also discloses a data center 3D modeling device.

Description

technical field [0001] The invention relates to data center monitoring technology, in particular to a data center 3D modeling method and device. Background technique [0002] With the development of ICT technologies such as Internet / mobile Internet technology and cloud computing, business processing is becoming more and more concentrated, and the requirements for computing and storage density are getting higher and higher, and the power density of data centers is also getting higher and higher. For example, traditional Internet services / enterprise services only require a power density of 2-3KW per rack, but for cloud computing services such as virtualization and desktop cloud, a rack power density of more than 10KW may be required. These new technologies The development of the Internet has put forward new requirements for the data center. [0003] Under this new situation, in order to keep up with the latest design ideas and technologies of data centers, micro-module data c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06T17/00
CPCG06F30/00
Inventor 陈滨亮占康
Owner ZTE CORP