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Laser heat conduction device

A technology of laser and laser module, applied in the field of laser, can solve the problems of generating a large number of laser modules, lack of heat dissipation structure, affecting the service life of laser modules, etc.

Active Publication Date: 2016-01-13
HUIZHOU JIEPUTE ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Based on this, it is necessary to provide a kind of laser heat conduction device to effectively absorb the laser module in the working A large amount of heat generated in the laser, and dissipate the heat, greatly improving the service life of the laser module

Method used

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Embodiment Construction

[0026] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0027] It should be noted that when an element is referred to as being “disposed on” another element, it may be directly on the other element or there may also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of ...

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Abstract

The invention discloses a laser heat conduction device, comprising laser modules, a heat insulation board, a cooling mechanism, and a heat conduction mechanism. The heat insulation board is provided with a plurality of insulation members which are arranged on the heat insulation board at intervals; and the laser modules are arranged between the insulation members; the cooling mechanism is connected to the heat insulation board; and the heat conduction mechanism is connected to the heat insulation board. The plurality of laser modules are separated by the heat insulation board, which enables the heat among plurality of the laser module not to be concentrated, and, in the meantime, the heat is radiated through the cooling mechanism after the heat insulation board absorbs the heat, which enables the heat of the laser modules to be effectively radiated and greatly prolongs the service life of the laser module.

Description

technical field [0001] The invention relates to the field of laser technology, in particular to a laser heat conduction device. Background technique [0002] With the continuous development of laser technology, more and more mature laser technology is applied in various technical fields, such as laser marking, laser printing, laser cutting and laser ranging, etc. Laser has strong directionality, high brightness and concentrated energy. Therefore, the laser light source often generates a lot of heat during work. If the heat is not dissipated in time, it will affect the working efficiency of the laser light source and related working components, and may even lead to the breakdown of the laser light source and related working components. burn. Contents of the invention [0003] Based on this, it is necessary to provide a kind of laser heat conduction device to effectively absorb the laser module in the working The large amount of heat generated in the laser can be dissipate...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20F21V29/10F21V29/503
Inventor 刘健黄治家成学平
Owner HUIZHOU JIEPUTE ELECTRONICS TECH