Solidification apparatus and solidification method
A technology of curing device and curing method, which is applied to the device for coating liquid on the surface, the arrangement of drying gas, lighting and heating equipment, etc., which can solve the problems of poor quality and difficult discharge of organic gas, so as to reduce the production cost of products and reduce condensation For the probability of particles, the effect of reducing the process time
Active Publication Date: 2016-01-27
BOE TECH GRP CO LTD +1
View PDF7 Cites 7 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0003] At present, the preparation method of flexible substrates is usually to coat PI (polyimide) glue on the glass substrate, and then send the glass substrate into the PI glue curing chamber for curing. During the curing process, in order to prevent the organic matter from being oxidized, To take out the organic gas (fume) generated in the PI glue in a timely manner requires continuous feeding of a large amount of N2. During the above-mentioned curing process, eddy currents are easily generated in the corners of the curing chamber, resulting in Organic gas is difficult to discharge, and it is easy to condense into particles on the flexible substrate, causing bad
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0035] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.
[0036] The embodiment of the present invention provides a curing device, which includes:
[0037] The chamber is used to hold the substrate coated with polyimide PI glue;
[0038] an air extraction device for evacuating the chamber;
[0039] The heating device is used for first heating the substrate to remove the organic gas in the PI glue when the chamber reaches a first preset pressure during the vacuuming process, and in the first After heating, a second heating is performed on the substrate to cure the PI glue.
[0040] The curing device provided by the embodiment of the present invention, by carrying out the process of removing organic gas in PI glue under the cond...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention provides a solidification apparatus and a solidification method. The solidification apparatus comprises a chamber for containing a substrate coated with a polyimide (PI) adhesive; a gas exhausting device for carrying out vacuum pumping of the chamber, and a heating device for carrying out first heating on the substrate when a pressure in the chamber reaches a first preset pressure in the vacuum pumping process to remove organic gases in the PI adhesive and for carrying out second heating on the substrate to solidify the PI adhesive after the first heating. The solidification apparatus provided by the invention allows the organic gases in the PI adhesive to be removed under vacuum gas exhausting conditions; and compared with the prior art, the method has the advantages of great improvement of the discharge effect of the organic gases, effective reduction of the probability of coagulation of the organic gases into particles, shortening of the required process time, and great reduction of the product making cost due to no need of continuous introduction of nitrogen.
Description
technical field [0001] The invention relates to the display field, in particular to a curing device and a curing method. Background technique [0002] Flexible display is an important development direction of next-generation display technology. This technology has the characteristics of being bendable, not fragile, ultra-light and ultra-thin, low power consumption, and portable. Broad application prospects and good development prospects. [0003] At present, the preparation method of flexible substrates is usually to coat PI (polyimide) glue on the glass substrate, and then send the glass substrate into the PI glue curing chamber for curing. During the curing process, in order to prevent the organic matter from being oxidized, To take out the organic gas (fume) generated in the PI glue in a timely manner requires continuous feeding of a large amount of N2. During the above-mentioned curing process, eddy currents are easily generated in the corners of the curing chamber, res...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): C03C17/00C03C17/28
CPCF26B21/14B05D3/0272B05D2203/35B05D2505/50
Inventor 熊黎陆忠张文轩范真瑞张宇杨远江蒋冬华李炳天高胜洲
Owner BOE TECH GRP CO LTD