Resin-sealing method and resin-sealing apparatus for electronic components

A technology of resin encapsulation device and electronic component

Active Publication Date: 2016-01-27
TOWA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] However, in Patent Document 1, the vent pin mounting plate on which the vent pin is mounted is continuously arranged at a position in the mold opening and closing direction of the mold for resin molding and at a position overlapping with the protruding mechanism of the molded product, and the The structure where the vent hole pin is arranged in the vent hole groove part shows that the structure of the mold and the effect based on this structure are complicated.

Method used

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  • Resin-sealing method and resin-sealing apparatus for electronic components
  • Resin-sealing method and resin-sealing apparatus for electronic components
  • Resin-sealing method and resin-sealing apparatus for electronic components

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Embodiment Construction

[0057] Below, based on figure 1 The illustrated embodiment illustrates the present invention.

[0058] figure 1 The overall structure of an embodiment of the resin sealing device according to the present invention using a so-called transfer molding unit is schematically shown.

[0059] The resin packaging device is provided with: a base 1 of the device; a tie rod 2 installed on the base 1 in an upright state; a fixing plate 3 mounted on the upper end of the tie rod 2; an upper template 4 mounted on the lower part of the fixing plate 3; resin The upper mold 5 (fixed mold) for forming is installed at the lower part of the upper mold plate 4; the movable plate 6 is embedded and installed in the tie rod 2 at the position below the upper mold 5; the lower mold plate 7 is installed on the movable plate 6 The upper part; the lower mold 8 (movable mold) for resin molding is installed on the upper part of the lower mold plate 7; and the mold opening and closing mechanism 9, etc., are set ...

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Abstract

The invention relates to a resin-sealing method and a resin-sealing apparatus for electronic components. According to the invention, the high-mobility resin material is adopted in the simple resin-sealing method. Meanwhile, the manufacturing cost of the apparatus for resin-sealing electronic components is lowered and the maintenance operation on the apparatus for resin-sealing electronic components is simplified based on a simple mold structure. The resin-sealing apparatus comprises resin sealing molds composed of an upper mold and a lower mold. The upper mold and the lower mold are opened and closed by means of a mold opening/closing mechanism. A cavity block can be moved to the parting surface of the upper mold along the mold opening/closing direction by means of a floating mechanism with a floating pin. On the parting surface of the upper mold, a cavity and a vent groove in communication with the cavity are arranged. The connection part of the cavity with the vent groove is provided with an embedded hole oriented towards the mold opening/closing direction. A vent block is arranged on a floating pin retaining frame corresponding to the embedded hole along the mold opening/closing direction. The vent block can slide to be tightly installed into the embedded hole.

Description

Technical field [0001] The present invention relates to a resin packaging method for electronic parts for packaging small electronic parts such as semiconductor lead frames or semiconductor chips on semiconductor substrates using resin materials, and an improvement of a resin packaging device for electronic parts for implementing the method . [0002] In more detail, it relates to an improved resin encapsulation method and resin encapsulation device. When the electronic components on the substrate before the resin encapsulation supplied and placed in the cavity of the resin encapsulation mold are resin-encapsulated, it can prevent The unfilled state of the resin and the formation of voids inside and outside the resin package can effectively prevent resin leakage from the vent portion communicating the inside and outside of the cavity. [0003] Furthermore, it relates to a resin encapsulation method and a resin encapsulation device that simplify the structure of a resin encapsulatio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56B29C45/34
CPCH01L21/565B29C45/34
Inventor 姬野智则诸桥信行
Owner TOWA
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