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Light emitting device and method for manufacturing the same

一种发光装置、发光元件的技术，应用在照明装置、印刷电路制造、照明装置的零部件等方向，能够解决色调偏移等问题，达到减低色相不均的效果

Active Publication Date: 2016-01-27
NICHIA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

As a result, the longer the optical path, the more components that excite the fluorescent substance dispersed in the sealing resin, so the color shift occurs

Method used

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  • Light emitting device and method for manufacturing the same
  • Light emitting device and method for manufacturing the same
  • Light emitting device and method for manufacturing the same

Examples

Experimental program
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Embodiment Construction

[0040] Hereinafter, the embodiment will be described in detail with reference to the drawings.

[0041] figure 1 It is a plan view showing a light emitting device according to an embodiment. figure 2 It is a cross-sectional view showing a light emitting device according to an embodiment. Figure 3A yes figure 2 Enlarged part of the image. Such as Figure 1 ~ Figure 3A As shown, the light-emitting device 1 has: a base body 10; a first frame body 11 disposed on the upper surface 10a of the base body 10; disposed on the upper surface 10a of the base body 10 and surrounding the first frame body 11 separately from the first frame body 11 The second frame 12.

[0042] The first frame body 11 and the second frame body 12 are each formed in a ring shape. A plurality of light emitting elements 2 are arranged in a region surrounded by the first frame body 11 on the upper surface 10a of the base body.

[0043] A first sealing resin 21 is arranged in a region surrounded by the fi...

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Abstract

Provided is a light emitting device that reduces the color unevenness between a plurality of semiconductor light emitting elements. A light emitting device (1) includes a base substrate (10), a first frame body (11) disposed on an upper surface (10a) of the base substrate (10), and a second frame body (12) disposed on the upper surface (10a) of the base substrate (10) and surrounding the first frame body (11) while being spaced away from the first frame body (11). A plurality of semiconductor light emitting elements (2) is disposed within a region surrounded by the first frame body (11). A first sealing resin (21) is disposed within the region surrounded by the first frame body (11) to cover the semiconductor light emitting elements (2). The first sealing resin (21) includes a wavelength conversion member that converts a wavelength of light emitted from the semiconductor light emitting elements (2). A second sealing resin (22) is disposed within the region surrounded by the second frame body (12) to cover the first sealing resin (21). The second sealing resin (22) has a light diffusion material layer (221) having a convex upper surface over the first sealing resin (21).

Description

technical field [0001] Embodiments of the present invention relate to light emitting devices and methods of manufacturing the same. Background technique [0002] In recent years, the use of light emitting diodes (Light Emitting Diodes: hereinafter also referred to as "LEDs") with lower power consumption has been developed in place of conventional incandescent lamps in general lighting lamps, and its application fields are also expanding. Among them, in spotlights, searchlights, etc., in order to improve the light extraction efficiency of the secondary optical system, high-output and high-quality LEDs with extremely small light-emitting parts and less uneven brightness and hue within the light-emitting surface are sought. [0003] As a method of reducing such uneven light emission, there is a method of mixing a filler with a sealing material of a light emitting element to diffuse light. For example, in order to realize a white LED, an example of a light-emitting device that ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/50H01L33/58H01L33/52
CPCH01L33/50H01L33/52H01L33/58H01L2924/181H01L33/486H01L33/505H01L33/54H01L33/62H01L2224/48137H01L2224/49113F21V5/04H01L2924/00012H01L25/0753H01L2933/0041H01L2933/005F21K9/90H01L33/507H05K3/303H05K2203/1322
Inventor 宇川宏明
Owner NICHIA CORP
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