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Substrate for electronic device package, electronic device package, electronic device, and method of manufacturing electronic device

A technology for electronic devices and manufacturing methods, which is applied in the manufacture of semiconductor/solid-state devices, electric solid-state devices, and components of semiconductor/solid-state devices, etc., can solve the problem of decreased airtightness of storage space, insufficient bonding of lids, and difficult shape of mother substrates. /size etc.

Inactive Publication Date: 2016-02-10
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is difficult to control the shape / size of the mother substrate (especially the concave portion) with high precision
In addition, there is a problem that due to the deformation caused by such shrinkage, the joint of the lid body is likely to become insufficient, and the airtightness of the storage space is lowered.

Method used

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  • Substrate for electronic device package, electronic device package, electronic device, and method of manufacturing electronic device
  • Substrate for electronic device package, electronic device package, electronic device, and method of manufacturing electronic device
  • Substrate for electronic device package, electronic device package, electronic device, and method of manufacturing electronic device

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Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach ＞

[0067] figure 1 It is a plan view showing the electronic device according to the first embodiment of the present invention. figure 2 Yes figure 1 The A-A line sectional view in. image 3 is showing figure 1 The shown electronic device has a top view of the vibrating element. Figure 4 is to show the figure 1 This is a cross-sectional view showing a state in which an electronic component is mounted on a circuit board. Figure 5 ~ Figure 8 are used to illustrate figure 1 A cross-sectional view of the fabrication method of the electronic device is shown. Also, in the following description, the figure 1 The near front side of the paper in and figure 2 The upper side in is called "upper", and the figure 1 inside of the paper in and figure 2 The lower side in is referred to as "lower".

[0068] "Electronic Devices"

[0069] like figure 1 and figure 2 As shown, an electronic device 1 serving as a vibrator has a package (electronic device package) 2 and a vibrating e...

no. 2 Embodiment approach ＞

[0108] Figure 9 It is a sectional view showing the electronic device according to the second embodiment of the present invention. Figure 10 is for illustration Figure 9 A cross-sectional view of a method of manufacturing a base substrate of an electronic device is shown.

[0109] Hereinafter, the electronic device according to the second embodiment of the present invention will be described, focusing on the differences from the above-mentioned embodiment, and the description of the same matters will be omitted.

[0110] The electronic device of the second embodiment is the same as that of the above-mentioned first embodiment except that the structure of the package is different. In addition, the same code|symbol is attached|subjected to the same structure as the above-mentioned embodiment.

[0111] like Figure 9As shown, in the base substrate 3 of the present embodiment, a pair of convex portions 391 and 392 protruding from the bottom surface of the concave portion 3 a...

no. 3 Embodiment approach ＞

[0118] Figure 11 It is a cross-sectional view showing an electronic device according to a third embodiment of the present invention.

[0119] Hereinafter, the electronic device according to the third embodiment of the present invention will be described, focusing on the differences from the above-mentioned embodiment, and the description of the same matters will be omitted.

[0120] The electronic device of the third embodiment is the same as that of the above-mentioned first embodiment except that the structure of the base substrate is different. In addition, the same code|symbol is attached|subjected to the same structure as the above-mentioned embodiment.

[0121] like Figure 11 As shown, in the base substrate 3 of the present embodiment, the first layer 31 is constituted by a laminate in which two ceramic layers 31A, 31B are laminated. Furthermore, an internal wiring layer 38 having a wiring 381 connecting the internal connection terminal 341 and the external connecti...

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Abstract

Provided are a substrate for an electronic device package, an electronic device packet, an electronic device and a method of manufacturing the electronic device, which can achieve both excellent relaxation properties and excellent dimensional accuracy. A base substrate includes a first layer which is a ceramic layer; a second layer which is disposed on one surface side of the first layer, and contains at least one of a glass layer, a silicon layer, and a quartz layer; and a concave portion that is opened on a side of the second layer opposite to the first layer. In addition, the concave portion is formed through etching.

Description

technical field [0001] The present invention relates to a substrate for electronic device packaging, electronic device packaging, an electronic device and a manufacturing method of the electronic device. Background technique [0002] For example, Patent Document 1 describes a cavity-shaped motherboard formed of a ceramic substrate and having a concave portion. In this way, by using the mother substrate as a ceramic substrate, the following effects can be exhibited. In the state where the mother board is mounted on the circuit board (mounting board), stress is applied to the mother board due to the difference in thermal expansion coefficient between the mother board and the circuit board. By forming the mother board with a ceramic substrate, the mother board can be made Since it is relatively soft, the stress can be absorbed / relaxed by the motherboard. Therefore, it is possible to prevent the stress from being transmitted to the electronic components mounted on the mother s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H9/125H03H9/02H03H3/007
CPCH01L2224/16225H01L2224/97H01L2924/16195H03H9/1021H03H3/02H03H9/17H01L23/49822H01L23/49838H01L21/4807H01L21/4857H01L21/52
Inventor 三上贤
Owner SEIKO EPSON CORP
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