Micro-electromechanical microphone packaging structure with improved back cover and its manufacturing method
A micro-electromechanical microphone, packaging structure technology, applied in the direction of electrical components, electrostatic transducer microphones, sensors, etc.
Inactive Publication Date: 2018-11-09
MERRY ELECTRONICS (SHENZHEN) CO LTD
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- Claims
- Application Information
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Problems solved by technology
Depend on figure 1 It can be seen from the figure that the electrical connection paths of the components inside the traditional MEMS microphone package structure 70 all depend on the lower substrate 71, and the substrate 71 even needs to be made with more layers in order to accommodate these complex wirings, which is currently The trend of electro-acoustic products all emphasizing thinness is relatively unfavorable
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[0024] The present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments.
[0025] In order to better understand the characteristics of the present invention, the present invention provides a first embodiment and is described as follows in conjunction with the drawings, please refer to Figure 2 to Figure 3 The main components of the micro-electromechanical microphone packaging structure 1 using the sloped wiring of the back cover in the present invention include a substrate 10, a back cover 20 and an acoustic wave sensor 30, and the structure of each component and the relationship between them are described in detail as follows:
[0026] Please refer first figure 2 , the substrate 10 is a multi-layer board, and several wiring electrodes 13 and metal bumps 12 are respectively provided on the top surface and the bottom surface, and the plurality of electrical connection structures 11 inside the substrate 10 m...
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The invention discloses a micro-electro-mechanical-system microphone packaging structure possessing an improved back cover. The structure comprises a substrate and a back cover. The back cover covers the substrate and is connected to the substrate. The back cover possesses a flat plate portion and at least two inclined blocks which connect one side wall of a periphery of the flat plate portion and are bulged inwardly from the sidewall. The back cover possesses at least two conductive paths which at least partially pass through equal inclined planes so as to connect a bottom surface of the flat plate portion and a bottom surface of the side wall. The flat plate portion is provided with a sound hole. A sonic sensor corresponds to the sound hole and is connected to the flat plate portion. The sonic sensor is electrically connected to the conductive path of the flat plate portion bottom surface. By using the micro-electro-mechanical-system microphone packaging structure possessing the improved back cover of the invention, the sonic sensor is electrically connected to the substrate through the conductive path; wiring of the substrate can be simplified, which is good for a thinning tendency of the substrate, and then a back cavity volume of a microphone is enlarged. In addition, a whole manufacturing technology is simple, which is good for mass manufacturing and cost reduction.
Description
technical field [0001] The present invention belongs to the field of micro-electromechanical microphone packaging structure, and specifically relates to a micro-electromechanical microphone packaging structure. The acoustic wave sensor is arranged on the back cover and can be wired three-dimensionally through the slope of the back cover, so that the acoustic wave sensor can pass through The back cover is electrically connected to a substrate connected to the back cover, so that the design of the substrate can be thinned, thereby increasing the volume of the back cavity. Background technique [0002] Compared with traditional microphones, micro-electro-mechanical microphones have the advantages of thinness, lightness, power saving, and price. Therefore, micro-electro-mechanical microphones are widely used in electro-acoustic products such as mobile phones. For traditional MEMS microphone package structure 70, please refer to figure 1 , which includes a substrate 71, an acous...
Claims
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IPC IPC(8): H04R19/04H04R31/00
Inventor 张朝森张詠翔陈振颐王俊杰
Owner MERRY ELECTRONICS (SHENZHEN) CO LTD