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Semiconductor Boundary Protection Sealants

A semiconductor and sealing coating technology, which is applied in semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve problems such as sealing ring damage, IC failure, damage, etc.

Active Publication Date: 2020-10-02
AVAGO TECH INT SALES PTE LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, sawing can damage areas close to the cut, especially dielectric and metallization layers
Additionally, the die coating may become delaminated from the metallization due to damage to the seal during separation
Therefore, delamination may penetrate inside the die's sealing ring and lead to eventual failure of the IC
Additional processes may also cause stratification to continue to propagate

Method used

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  • Semiconductor Boundary Protection Sealants
  • Semiconductor Boundary Protection Sealants
  • Semiconductor Boundary Protection Sealants

Examples

Experimental program
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Embodiment Construction

[0077] ICs can be manufactured at the wafer level, where 10, 100, or 1000 ICs are formed within a single semiconductor wafer. The wafer material can be silicon, gallium arsenide, or other semiconductor materials. Referring now to the drawings, wherein like reference numerals designate like or corresponding parts throughout the several views, Figure 1A A wafer 100 containing a plurality of ICs 110 is shown. IC 110 may be square or rectangular in shape, among other shapes suitable for a particular manufacturing process.

[0078] Figure 1B A cross-sectional area of ​​IC 110 is shown. IC 110 has an inactive surface 120 and an active surface 130 . Active surface 130 has a plurality of conductive contact areas or contact pads 140 designed to enable interconnection of IC 110 with other devices or substrates. The IC contact pad 140 may have multiple layers, which is called under-bump metallization (UBM). The base conductive layer may contain aluminum. Because the solder does ...

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Abstract

The present invention relates to semiconductor boundary protection encapsulants, wherein a semiconductor package includes a semiconductor unit comprising an active circuit layer. The semiconductor package also includes a plurality of bonding pads on the active circuit layer, the plurality of bonding pads being configured to connect to corresponding external conductive connectors. The semiconductor package also includes a protective seal coating that fills the edges of the recess of the active circuit layer. The protective seal coat contains the outer wafer separation surface.

Description

[0001] related application [0002] This application claims priority to US Application No. 14 / 518,947, filed October 20, 2014, and US Provisional Application No. 62 / 037,899, filed August 15, 2014, the entire contents of which are hereby incorporated by reference. technical field [0003] The present invention relates to semiconductor packaging. Background technique [0004] A semiconductor package may be a metal, plastic, glass, or ceramic enclosure containing one or more semiconductor electronic components, also known as a die or an integrated circuit (IC). Encapsulation provides protection against impact and corrosion, as well as environmental factors such as moisture, oxidation, high temperature, and contaminants. Electrical contacts or wires extend from the package and are connected to other devices and / or to an intermediate substrate, or directly to the circuit board. A package may have as few as two wires or contacts for a device such as a diode, or hundreds of wires...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/492H01L23/29H01L21/56H01L23/31
CPCH01L23/3114H01L24/94H01L2224/0401H01L2224/04042H01L2224/32225H01L2224/48091H01L2224/48227H01L2224/73265H01L2224/94H01L2224/11002H01L2223/54486H01L21/6836H01L2221/68336H01L2221/68381H01L2924/00014H01L2924/181H01L2224/04105H01L2224/12105H01L23/3185H01L2224/13082H01L2224/136H01L2924/10156H01L2224/131H01L2224/13147H01L23/3178H01L21/561H01L21/568H01L21/78H01L24/96H01L23/544H01L2221/68327H01L2224/96H01L2224/11H01L2924/00012H01L2224/45099H01L2924/00H01L2924/014H01L21/565H01L21/6835H01L24/14H01L24/46H01L23/3135H01L22/14H01L2221/68359H01L24/95H01L2224/95
Inventor 赵子群加伦·柯克帕特里克罗立德雷佐尔·拉赫曼·卡恩施明煌
Owner AVAGO TECH INT SALES PTE LTD
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