Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

LED lamp bead encapsulation technology

A technology of LED lamp beads and packaging technology, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., to achieve the effects of accurate production process control, high quality, and good durability

Inactive Publication Date: 2016-03-02
ANHUI FUN OPTOELECTRONICS TECH
View PDF3 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage of the existing technical solution is that the PC cover used is limited by the material characteristics, and its temperature resistance is poor. At the same time, it is necessary to cover each bracket with a PC lens or mold strip during the manufacturing process, and then inject silica gel into each bracket. The control of temperature and time is not optimized. Due to the limited process level, the production efficiency is low, bubbles are easy to be generated, and the durability of the LED is poor, and the post-baking process is not sufficient, resulting in a greatly reduced pass rate of the LED. In order to solve the problem There is a problem, we need to use a new packaging process to package LED lamp beads

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A packaging process for LED lamp beads, comprising the following steps

[0024] (1) Cleaning: Ultrasonic waves are used to clean the bracket, which is a copper substrate.

[0025] (2) Die expansion: Expand the film bonding the chips by using a chip expander, so that the distance between the LED chips is stretched to about 0.6mm.

[0026] (3) Die solidification: First, wake up and stir the cured glue, the temperature of the wake-up material is 22 degrees, and then point it on the corresponding position of the bracket, and manually install the expanded LED chip on the stabbing table under the microscope superior.

[0027] (4) Short baking: Put the cured chip into the oven to bake, the firing temperature is 160 degrees, and the firing time is 2 hours.

[0028] (5) Wire bonding: use a gold wire bonding machine to connect the electrode to the LED chip. The bonding power of the wire bonding machine is 90MW.

[0029] (6) Pre-test: Test the welded gold wire, requiring the go...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an LED lamp bead encapsulation technology, and relates to the field of LED lamp production technologies. The LED lamp bead encapsulation technology mainly comprises the steps of cleaning, wafer expanding, die bonding, short baking, line welding, pre-testing, product forming, post-baking, glue pouring, and product forming. An LED lamp produced by the LED lamp bead encapsulation technology has the advantages of high durability, high luminous intensity and high quality. The production process is controlled accurately, and detailed method and parameter description is provided for each link.

Description

Technical field: [0001] The invention relates to the field of LED lamp production technology, and in particular designs a packaging technology for LED lamp beads. technical background: [0002] LED, light-emitting diode, is a solid-state semiconductor device that can convert electrical energy into visible light. It can directly convert electrical energy into light. The heart of the LED is a semiconductor chip. One end of the chip is attached to a bracket, and the other end is the negative pole. The other end is connected to the positive stage of the power supply, so that the entire chip is encapsulated by epoxy resin. [0003] The protective glue used at the end of the existing high-power LED lamp bead packaging process is generally in the form of pressure injection. The silicone is injected into the PC cover that has been buckled, and the PC cover is filled with the silicone, and the air is discharged to play a role. Protect the chip from external oxidation interference,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/52
CPCH01L33/48H01L33/52H01L2933/0033H01L2933/005
Inventor 汪卫国
Owner ANHUI FUN OPTOELECTRONICS TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com