Method for grabbing internal layer compensation coefficients
A compensation coefficient and inner layer technology, which is applied in multilayer circuit manufacturing, electrical components, printed circuit manufacturing, etc., can solve the problem of not being able to provide data support for inner layer compensation coefficient adjustment, reduce the risk of layer deviation, and improve production efficiency Effect
Inactive Publication Date: 2016-03-02
JIANGMEN SUNTAK CIRCUIT TECH
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Problems solved by technology
[0003] The present invention aims at the problem that the existing layer deviation detection method cannot provide data support for the adjustment of the inner layer compensation coefficients of the subsequent layers, and provides a method that can accurately capture the inner layer compensation coefficients in the process of detecting the layer deviation for subsequent each layer. The adjustment of the inner layer compensation coefficient of the layer provides a data-supported method, which is especially suitable for the layer deviation detection of the false layer board or the laminated structure of the core board with different compensation coefficients
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Embodiment
[0018] This embodiment provides a method for capturing the compensation coefficient of the inner layer. Specifically, in the production process of the PCB, when multiple core boards are pressed together to form a multi-layer board, the layer deviation of the multi-layer board is detected and checked at the same time. The expansion and contraction of each layer of core board.
[0019] The multilayer board tested in this embodiment has six copper layers, including a first outer core board, a second outer core board, and an inner core board. From top to bottom, the stacking sequence is: the first outer core board, the inner core board, and the second outer core board. The thickness of the first outer core board and the second outer core board are both 0.15mm (excluding copper), the tensile coefficient is the same, and the tensile coefficients of the long side and the short side are both 4 / 10,000; the thickness of the inner core board is 1.19 mm, the stretch coefficient of the lo...
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The invention relates to the circuit board production technology field and particularly relates to a method for grabbing internal layer compensation coefficients. According to the method, a board edge PAD is arranged on each layer deviation detection zone of a line layer, horizontal distances of the board edge PADs of two adjacent layers are identical, a stitching x-ray detector can be used during final detection to measure the horizontal distances of the two adjacent board edge PADs after stitching, the horizontal distances after stitching are compared with the horizontal distances before stitching, internal layer compensation coefficients, namely Fiering coefficients belonging to certain circuit board layers need adjustment and can be more accurately analyzed, data support can be provided for subsequently making internal layer coefficient compensation rules of layer deviation boards in the types, layer deviation risks are reduced, moreover, layer deviation reasons can be rapidly determined through measuring expansion and contraction among layers when layer deviation caused by multiple types of stitching abnormality such as board slipping and inaccurate internal layer coefficient compensation, and thereby production efficiency is improved.
Description
technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for grabbing inner layer compensation coefficients. Background technique [0002] Printed Circuit Board (PCB) is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. Printed circuit boards are almost all multi-layer circuit boards, and the inner layers of multi-layer circuit boards are almost all conducted by means of plated through holes. If the offset between layers reaches a certain level, it will cause drilling deviation. A short circuit occurs in the hole, and the circuit board is scrapped. Therefore, in the production process of PCB, it is a key link to realize accurate alignment between layers. In the current PCB production, X-Ray machine full inspection or random inspection of layer deviation alignment rings are used to monitor the layer deviation before and a...
Claims
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Login to View More IPC IPC(8): H05K3/46
CPCH05K3/4638H05K2203/166
Inventor 梁健志刘建辉戴勇白会斌
Owner JIANGMEN SUNTAK CIRCUIT TECH