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Prefabricated structure and method of forming same, and method of soldering semiconductor chip arrangement

A prefabricated structure, semiconductor technology, used in semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc.

Active Publication Date: 2018-05-22
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However with diffusion solder, other means may be required to maintain the flat shape of the chip, which may generate mechanical forces in addition to temperature stress

Method used

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  • Prefabricated structure and method of forming same, and method of soldering semiconductor chip arrangement
  • Prefabricated structure and method of forming same, and method of soldering semiconductor chip arrangement
  • Prefabricated structure and method of forming same, and method of soldering semiconductor chip arrangement

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Embodiment Construction

[0014] Various example embodiments will now be described more fully with reference to the accompanying drawings in which some example embodiments are illustrated. In the drawings, the thickness of lines, layers and / or regions may be exaggerated for clarity.

[0015] Therefore, while the example embodiments are capable of various modifications and alternative forms, embodiments thereof are shown in the drawings as examples and will be described herein in detail. It should be understood, however, that there is no intent to limit example embodiments to the particular forms disclosed, but on the contrary example embodiments are to cover all modifications, equivalents, and alternatives falling within the scope of the disclosure. Throughout the description of the figures, like numerals refer to like or analogous elements.

[0016] It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled t...

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Abstract

The present invention relates to prefabricated structures and methods of forming them, and to methods of soldering semiconductor chip arrangements. A prefabricated structure for soldering semiconductor chip arrangements includes a carbon fiber composite sheet and a solder layer formed on the carbon fiber composite sheet.

Description

technical field [0001] Embodiments relate to soldering semiconductor chips and in particular to prefabricated structures for soldering semiconductor chip arrangements, methods for forming prefabricated structures for semiconductor chip arrangements, and methods for soldering semiconductor chip arrangements. Background technique [0002] Temperature stress between the silicon chip and the lead frame may be caused by the solder connection. With soft solder, a solder alloy pad between the chip and the substrate can allow deformation of the chip, which minimizes its internal temperature stress, as long as the solder is liquid. With diffusion solder, however, other means may be required to maintain the flat shape of the chip, which may generate mechanical forces in addition to temperature stress. These stresses are considerable when compared to soft solder and may permanently reside in individual layers of the chip. Contents of the invention [0003] Some embodiments relate t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/488H01L23/495H01L21/58
CPCB23K35/0233H01L2224/32013H01L2224/271H01L2224/29247H01L2224/29447H01L24/03H01L24/05H01L24/06H01L24/32H01L2224/03462H01L2224/04026H01L2224/05647H01L2224/05747H01L2224/06181H01L2224/2712H01L2224/2908H01L2224/29111H01L2224/29393H01L2224/32014H01L2224/32057H01L2224/32058H01L2224/32245H01L2224/83101H01L2224/83191H01L2224/83192H01L2224/83447H01L2224/83825H01L2224/29271H01L2224/05893H01L2224/29471H01L2224/83693B23K35/3006B23K35/3013B23K35/007B23K35/0244B23K2101/40B23K2103/172B23K35/36H01L2924/351B23K1/0016B23K35/0238B23K35/302B23K35/32H01L24/27H01L24/29H01L24/83H01L2224/2711H01L2224/29082H01L2224/29139H01L2224/29144H01L2924/0105H01L2924/0132H01L2924/014H01L2924/2064H01L2924/20641H01L2924/20642H01L2924/20643H01L2924/20644H01L2924/00014H01L2924/01006H01L2924/00012B32B15/14H01L2224/27442H01L2224/2746H01L2224/276H01L2224/29147H01L2224/29157H01L2224/29193H01L2224/831H01L2224/8382H01L2224/29083
Inventor F.克勒纳
Owner INFINEON TECH AG