Manufacturing method of multilayer printed circuit board and multilayer printed circuit board

A multi-layer printing and manufacturing method technology, which is applied in the fields of printed circuit manufacturing, multi-layer circuit manufacturing, printed circuit, etc., can solve problems such as the inability to meet the production requirements of multiple lamination high-precision printed circuit boards
CN105430944BActive Publication Date: 2018-05-25GUANGZHOU FASTPRINT CIRCUIT TECH +2
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Patents(China)
Current Assignee / Owner
GUANGZHOU FASTPRINT CIRCUIT TECH
Publication Date
2018-05-25

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Abstract

The invention relates to a manufacturing method for a multi-layer printed circuit board and the multi-layer printed circuit board. The manufacturing method for the multi-layer printed circuit board comprises the following steps of: performing inner layer pattern transfer on all first core boards, forming a first groove hole by utilizing a first positioning hole formed by development, laminating all the first core boards by utilizing the first groove hole to form a first circuit layer sub-board, and forming a second groove hole; and performing inner layer pattern transfer on all second core boards, forming a third groove hole by utilizing a third positioning hole formed by development, performing superposition according to a preset first motherboard structure order, and laminating a first circuit layer and a second circuit layer to form a motherboard. According to the manufacturing method for the multi-layer printed circuit board, the alignment precision of multi-time lamination is improved and the press-fit precision of the multi-layer printed circuit board is enhanced.
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Description

technical field

[0001] The invention relates to the technical field of multilayer printed circuit boards, in particular to a method for manufacturing a multilayer printed circuit board and the multilayer printed circuit board. Background technique

[0002] With the continuous development of electronic products in the direction of multi-function, miniaturization, light weight, and high performance, the requirements for miniaturization and high density of printed circuit boards are also increasing. Its products are also developing from traditional printed boards to high-density laminated printed boards. Interlayer alignment deviation control is an important issue faced by PCB (printed circuit board) manufacturers. To a certain extent, interlayer alignment capability represents the technical level of PCB (printed circuit board) manufacturing technology. Therefore, improving the interlayer alignment capability is of great significance to improving the PCB (printed circuit board...

Claims

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