Hot plate structure for automatic cleaning of collection cups

Abstract

The invention relates to the field of semiconductor equipment, in particular to a hot plate structure for cleaning a collection cup automatically. The hot plate structure comprises a gas-liquid mixture sliding ring, an upper hot plate, a rotating shaft, a nozzle and the collection cup. The upper hot plate and the gas-liquid mixture sliding ring are arranged at the upper end and the lower end of the rotating shaft respectively. The collection cup is arranged on the lower side of the upper hot plate. The rotating shaft is provided with a rotating shaft gas channel and a rotating shaft liquid channel in the axial direction. A rotating shaft gas inlet and a rotating shaft liquid inlet are formed in the external circumference of the lower end of the rotating shaft. The rotating shaft gas inlet and the rotating shaft liquid inlet are communicated with a gas outlet and a liquid outlet of the end of a rotor of the gas-liquid mixture sliding ring respectively. The upper hot plate is provided with an upper hot plate gas channel and an upper hot plate liquid channel which are communicated with the rotating shaft gas channel and the rotating shaft liquid channel respectively. The nozzle communicated with the upper hot plate liquid channel is arranged on the outer cylinder surface of the upper hot plate. The upper surface of the upper hot plate is provided with a plurality of vacuum adsorption holes communicated with the upper hot plate gas channel. According to the hot plate structure, the function of cleaning the collection cup automatically is achieved, and meanwhile vacuum adsorption on wafer can be achieved on the surface of the upper hot plate.

Description

Technical field [0001] The invention relates to the field of semiconductor equipment, in particular to a hot plate structure for automatically cleaning a collecting cup. Background technique [0002] At present, with the diversification of semiconductor manufacturing processes, many process treatments in equipment are becoming more and more complicated, and it is often necessary to spray the wafers during the manufacturing process. Depending on the process, the spraying time may vary. In addition, the sprayed chemicals in different manufacturing processes are also inconsistent. After the process is completed, there are often some chemical residues on the CUP components (collecting cups). At present, after the wafer is sprayed, it is necessary to spray the CUP components at regular intervals. (Refers to the collection cup directly sprayed with chemicals) It is removed from the equipment for cleaning, and then reinstalled on the equipment after cleaning, which is time-consuming and...

AI Technical Summary

Problems solved by technology

Moreover, the chemicals sprayed in different processes are also inconsistent. After the process is completed, there are often some chemical agents left on the CUP component (collection cup). At present, after the wafer is sprayed, it is necessary to spray the CUP component (Referring to the collection cup that is directly sprayed with chemicals) It is disassembled from the equipment for cleaning, and then reinstalled on the equipment after cleaning, which is time-consuming and laborious

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