LED lamp and production process thereof
A technology of LED lamps and production technology, which is applied in the direction of lighting auxiliary devices, lighting and heating equipment, semiconductor devices of light-emitting elements, etc., which can solve the problems of waste and limited lighting range, so as to improve the service life and increase the lighting Range, the effect of increasing range
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Embodiment 1
[0032] like figure 1 As shown, an LED lamp includes LED light-emitting chips 2 and a substrate 1, and the substrate 1 is made of a transparent material; The adjacent LED light-emitting chips 2 in the row are connected in series, and the LED light-emitting chips 2 are connected in parallel.
[0033] The LED lamp uses a transparent material as the substrate 1, and the light emitted by the LED light-emitting chip 2 can pass through the substrate 1 and be projected to the back of the substrate 1, thereby increasing the illumination range of the LED light-emitting chip 2.
[0034] The LED light in this embodiment adopts the method of mixed connection. If a certain LED light-emitting chip 2 is disconnected during use, it will only affect a certain row of LED light-emitting chips 2, and will not affect the entire light-emitting matrix. Make a difference without having to replace the entire LED light.
Embodiment 2
[0036] On the basis of Embodiment 1, multiple rows of LED light-emitting chips 2 form a light-emitting matrix to increase the lighting range, and at the same time, in order to further protect the LED light-emitting chips 2 and the substrate 1, the substrate 1 A fluorescent glue 3 is provided on the front, and the fluorescent glue 3 covers the LED light-emitting chip 2 .
[0037] The back of the substrate 1 is also provided with fluorescent glue 3 , and the fluorescent glue 3 on the back of the substrate 1 is symmetrical to the fluorescent glue 3 on the front of the substrate 1 . The fluorescent glue 3 is a mixture of AB glue and phosphor powder, and the AB glue and phosphor powder are mixed evenly in any proportion. On the one hand, the AB glue plays the role of cushioning and sealing; on the other hand, because the AB tape has colors, colorful LED lights can be produced.
[0038] The adjacent LED light-emitting chips 2 in the row are connected by metal wires 4 , and the rows...
Embodiment 3
[0040] This embodiment provides a production process of the LED lamp described in Embodiment 2, comprising the following steps:
[0041] Fixing the LED light-emitting chip 2 on the front surface of the substrate 1;
[0042] Using wires to electrically connect the LED light-emitting chips 2;
[0043] The fluorescent glue 3 is laid on the front and back of the substrate 1 by dispensing or molding.
[0044] The production process has the advantages of simple operation and high yield.
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