Unlock instant, AI-driven research and patent intelligence for your innovation.

Preparation method of low-cost patterned thick silver film

A graphic, low-cost technology, applied in the field of micro-processing, can solve the problems of low film deposition rate and high cost, and achieve the effects of low cost, simple equipment and simple process

Inactive Publication Date: 2018-11-16
SHANGHAI JIAOTONG UNIV
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This patterned silver film method uses evaporation technology and reactive ion etching technology, not only the film deposition rate is low, usually only silver film with nanometer thickness can be obtained, and the cost is very high

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Preparation method of low-cost patterned thick silver film
  • Preparation method of low-cost patterned thick silver film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Such as figure 1 As shown, the present embodiment provides a method for preparing a low-cost patterned thick silver film, comprising the following steps:

[0026] (1) Take a 3-inch glass sheet, first clean the surface of the glass sheet with calcium carbonate, and then carry out the cleaning water ultrasonic, weak alkali ultrasonic, clear water ultrasonic, chromic acid ultrasonic, clear water ultrasonic, and drying treatment on the glass sheet to obtain the cleaned glass sheet; Cr-Cu seed layer is sputtered on the cleaned glass sheet, followed by positive photoresist (model AZ4620), baking, exposure, and development. According to the shape of the designed mask, the photoresist structure can be realized. patterning; the shape of the patterned photoresist is a square array unit with a pitch of 300 μm and a side length of 100 μm;

[0027] (2) Put the patterned seed layer into the acidic silver plating solution, direct current electroplating can be used, and then the photo...

Embodiment 2

[0031] Such as figure 1 As shown, the present embodiment provides a method for preparing a low-cost patterned thick silver film, comprising the following steps:

[0032] (1) Take a 3-inch glass sheet, first clean the surface of the glass sheet with calcium carbonate, and then carry out the cleaning water ultrasonic, weak alkali ultrasonic, clear water ultrasonic, chromic acid ultrasonic, clear water ultrasonic, and drying treatment on the glass sheet to obtain the cleaned glass sheet; Cr-Cu seed layer is sputtered on the cleaned glass sheet, followed by positive photoresist (model AZ4620), baking, exposure, and development. According to the shape of the designed mask, the photoresist structure can be realized. patterning; the shape of the patterned photoresist is a rectangular array, the pitch of the rectangular array units is 100 μm, and the length and width are 231 μm and 115 μm, respectively;

[0033] (2) Put the patterned seed layer into the acidic silver plating solution...

Embodiment 3

[0037] This embodiment provides a method for preparing a low-cost patterned thick silver film, comprising the following steps:

[0038] (1) Take a 3-inch glass sheet, first clean the surface of the glass sheet with calcium carbonate, and then carry out the cleaning water ultrasonic, weak alkali ultrasonic, clear water ultrasonic, chromic acid ultrasonic, clear water ultrasonic, and drying treatment on the glass sheet to obtain the cleaned glass sheet; Cr-Cu seed layer is sputtered on the cleaned glass sheet, followed by positive photoresist (model AZ4620), baking, exposure, and development. According to the shape of the designed mask, the photoresist structure can be realized. graphics;

[0039](2) Put the patterned seed layer into the acidic silver plating solution, direct current electroplating can be used, and then the photoresist is removed to obtain a circular array of silver films; wherein: the acidic silver plating solution components are: Sodium thiosulfate 250g / L, si...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention provides a method for preparing a graphical thick silver film with low cost. The method comprises the steps that 1, the surface of a glass sheet is washed with calcium carbonate, then the glass sheet is subjected to ultrasonic treatment in an alkaline solution and an acid solution in sequence, deionized water is used for ultrasonic washing, and drying treatment is carried out; 2, a Cr / Cu seed layer is sputtered on the glass sheet thoroughly washed in the first step, glue photoresist throwing, glue drying, exposure and developing are carried out in sequence, and photoresist structure graphical treatment is achieved; and 3, the glass sheet treated in the second step is electroplated in the acid silver-plating plating solution environment, then photoresist and the seed layer are removed, and finally the graphical silver film is achieved. The preparation process can be compatible with a micromachining process, and meanwhile the method has the advantages of being low in cost, simple in equipment, easy to control and the like, and is hopefully applied to the fields of medical instruments, the electronic industry and the like.

Description

technical field [0001] The invention relates to a manufacturing method in the technical field of micromachining, in particular to a method for preparing a low-cost patterned thick silver film. Background technique [0002] Silver has high thermal conductivity, electrical conductivity, good gloss and welding performance, so it is widely used in the fields of medical equipment, electronics industry, communication configuration, instrumentation manufacturing and decoration. Currently, commonly used processes for the production of silver films include dry process and wet process. The dry process (such as sputtering, evaporation process, etc.) has high cost and low film formation rate, and is generally only suitable for preparing thin films with nanometer thickness. At the same time, the dry process wastes a lot of materials, and the cost of equipment input is also very high. Compared with the dry process, the wet process has the advantages of low cost and simple equipment. In...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C25D5/02C25D3/46
CPCC25D3/46C25D5/022
Inventor 王博宋正锡杨卓青汪红丁桂甫程萍
Owner SHANGHAI JIAOTONG UNIV