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Novel crystal packaging mould

A crystal, a new type of technology, applied in the manufacture of semiconductor/solid-state devices, electrical components, circuits, etc., can solve the problems of chip group overflow sealing, etc., to achieve the effect of convenient operation, increased production speed, and simple structure

Inactive Publication Date: 2016-04-20
CHONGQING ATEC TEST EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, when the chip set is packaged, the chip will be crushed because the chip set is too high, or the sealant will overflow because the chip set is too low.

Method used

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  • Novel crystal packaging mould

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Embodiment Construction

[0011] Below in conjunction with accompanying drawing and embodiment

[0012] The present invention is described further:

[0013] like figure 1 As shown, a novel crystal package mold includes a chip group 6 and a package mold set 7. The package mold set 7 includes a loam cake 1 and a lower seat 2. A cavity 5 is formed inside the loam cake 1, and the upper surface of the cavity 5 is The inner top surface 3 is provided with a pressure-relieving layer 4 on the inner top surface 3 .

[0014] The chip group 6 includes a lead frame 9, a crystal 10 is arranged above the lead frame 9, a metal conductive track 11 is arranged above the crystal 10, conductive pins 13 are arranged on the left and right sides of the metal conductive track 11, and the ends of the conductive pins 13 are connected to the The lead frame 9 is connected to ensure a better electrical connection between the chip and the lead frame.

[0015] The crystal 10 and the lead frame 9 are connected by a metal connectio...

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Abstract

The invention relates to a novel crystal packaging mould which comprises a wafer group and a packaging mould group, wherein the packaging mould group comprises an upper cover and a lower seat; a cavity is formed in the upper cover; the upper surface of the cavity is an internal top surface; a buffering layer is arranged on the internal top surface; the wafer group comprises a lead frame; a crystal is arranged above the lead frame; a metal conductive track is arranged above the crystal; the crystal is connected and fixed with the metal conductive track and the lead frame by an adhesive; the metal conductive track is provided with a conductive pin; and the tail end of the conductive pin is connected with the lead frame. The novel crystal packaging mould is simple in structure and convenient to operate; by arranging the buffering layer on the top end of the cavity of the packaging mould group, the purpose that the wafer group is not crushed during packaging is achieved, and therefore, wafer production speed and product qualified ratio are promoted and packaging cost is lowered.

Description

technical field [0001] The invention relates to a mold, in particular to a packaging mold. Background technique [0002] Chip packaging is usually completed with packaging molds. Generally, after the crystal is assembled into a chip group, due to errors in the crystal assembly process, there is a certain difference in the height of the crystal after being assembled into a chip group. Then the packaging process is , the height of the package space of the package mold is fixed. Therefore, when the chip set is packaged, the chip will be crushed because the chip set is too high, or the sealing glue will overflow because the chip set is too low. [0003] Therefore, those skilled in the art are devoting themselves to developing a packaging mold that will not crush the chip and will not overflow the sealant. Contents of the invention [0004] In view of the above-mentioned defects in the prior art, the technical problem to be solved by the present invention is to provide a pack...

Claims

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Application Information

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IPC IPC(8): B29C45/26B29C45/14H01L21/67
CPCB29C45/2602B29C45/14H01L21/67121
Inventor 许斌周建谢绍军
Owner CHONGQING ATEC TEST EQUIP
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