Novel mould for manufacturing crystals

Abstract

The invention discloses a novel mould for manufacturing crystals. The novel mould comprises a wafer group and a packaging mould group, wherein the packaging mould group comprises an upper cover and a lower base; a cavity is formed in the upper cover; the upper surface of the cavity is an inner top surface; a pressure buffer layer is arranged on the inner top surface; the wafer group comprises a lead frame; a crystal is arranged above the lead frame; a metal electric-conduction rail is arranged above the crystal; the crystal is fixedly connected with the metal electric-conduction rail and the lead frame through adhesives; the metal electric-conduction rail is provided with electric-conduction pins; and the tail ends of the electric-conduction pins are connected with the lead frame. The novel mould disclosed by the invention is simple in structure and convenient to use; the pressure buffer layer is arranged at the top end of the cavity of the packaging mould group, so that the aim that the wafer group is not crushed during the packaging process is achieved; the manufacture speed and the product qualification rate of wafers are improved; and the packaging cost is lowered.

Description

technical field [0001] The invention relates to a mold, in particular to a packaging mold. Background technique [0002] Chip packaging is usually completed with packaging molds. Generally, after the crystal is assembled into a chip group, due to errors in the crystal assembly process, there is a certain difference in the height of the crystal after being assembled into a chip group. Then the packaging process is , the height of the package space of the package mold is fixed. Therefore, when the chip set is packaged, the chip will be crushed because the chip set is too high, or the sealing glue will overflow because the chip set is too low. [0003] Therefore, those skilled in the art are devoting themselves to developing a packaging mold that will not crush the chip and will not overflow the sealant. Contents of the invention [0004] In view of the above-mentioned defects in the prior art, the technical problem to be solved by the present invention is to provide a pack...

AI Technical Summary

Problems solved by technology

Therefore, when the chip set is packaged, the chip will be crushed because the chip set is too high, or the sealant will overflow because the chip set is too low.

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