Manufacturing method of circuit board

A production method and circuit board technology, applied in the fields of printed circuit manufacturing, printed circuit, electrical components, etc., can solve the problems of time-consuming, complicated process, waste of copper foil, etc., so as to reduce production cost, speed up production speed, process simple effect

Inactive Publication Date: 2016-04-06
SHENNAN CIRCUITS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] On the one hand, the process of making circuit boards in the prior art is complicated. If it is a double-sided circuit board with simple circuit graphics, it takes too much time to make circuit graphics, which affects the delivery time of the circuit board; on the other hand, due to the current In the existing technology, copper foil blanking is used for processing, which is a waste of copper foil and high cost

Method used

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  • Manufacturing method of circuit board
  • Manufacturing method of circuit board
  • Manufacturing method of circuit board

Examples

Experimental program
Comparison scheme
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Embodiment 1

[0023] Please refer to figure 1 , an embodiment of the present invention provides a method for manufacturing a circuit board, which may include:

[0024] 101. Make a circuit board mold, the surface of the circuit board mold has raised circuit graphics;

[0025] Please refer to figure 2 and image 3 , are a plan view and a cross-sectional view of the circuit board mold respectively, and the circuit board mold 200 is produced, and the surface of the circuit board mold 200 has a raised circuit pattern 201 .

[0026] Optionally, a circuit board mold 200 is produced, and the surface of the circuit board mold 200 has a raised circuit pattern 201 including:

[0027] The circuit board mold 200 is made of a material that does not stick to resin glue, and the material that does not stick to resin glue is poured according to the circuit pattern 201 of the preset circuit board and iron solution is used to form a raised circuit pattern 201 on the surface of the circuit board mold 200 ...

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PUM

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Abstract

The invention discloses a manufacturing method of a circuit board. The method comprises the steps that a circuit board mould is manufactured, and the surface of the circuit board mould is provided with convex line graphs; the circuit board mould and a false core board are laminated so that concave line graph grooves are formed on the false core board; and copper deposition and electroplating are performed on the false core board, the line graph grooves are filled through electroplating, and corresponding line graphs are formed in the line graph grooves so that the circuit board is manufactured. The manufacturing method of the circuit board is used for solving the existing problems of manufacturing of the circuit board in the prior art so that manufacturing rate of the circuit board is accelerated.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a method for manufacturing a circuit board. Background technique [0002] Printed Circuit Board (PCB), also known as printed board or circuit board, is one of the important components of electronic products. Electronic products made of circuit boards have high reliability, good consistency, high mechanical strength, light weight, With the advantages of small size and easy standardization, almost every kind of electronic equipment, from small electronic watches and calculators to large computers, communication equipment, and electronic radar systems, as long as there are electronic components, the electrical interconnection between them must be used circuit board. [0003] The current conventional process for making double-sided circuit boards is: blanking, drilling, copper sinking, electroplating, external drawing, external corrosion, external inspection, solder mask, exp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/18
Inventor 王蓓蕾刘宝林缪桦
Owner SHENNAN CIRCUITS
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