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Crystal package mould

A crystal and mold technology, applied in the field of packaging molds, can solve the problems of chip group overflow sealing glue, etc., achieve the effect of convenient operation, lower product quality rate, and increase production speed

Inactive Publication Date: 2016-03-16
重庆市靳彬农业科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, when the chip set is packaged, the chip will be crushed because the chip set is too high, or the sealant will overflow because the chip set is too low.

Method used

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  • Crystal package mould

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Embodiment Construction

[0010] Below in conjunction with accompanying drawing and embodiment

[0011] The present invention is described further:

[0012] Such as figure 1 As shown, a crystal package mold includes a chip group 6 and a package mold set 7. The package mold set 7 includes a loam cake 1 and a lower seat 2. A cavity 5 is formed inside the loam cake 1, and the upper surface of the cavity 5 is an inner The top surface 3 and the inner top surface 3 are provided with a pressure-relieving layer 4 .

[0013] The chip group 6 includes a lead frame 9, a crystal 10 is arranged above the lead frame 9, a metal conductor 11 is arranged above the crystal 10, and a conductive pin 13 is arranged on the metal conductor 11, and the ends of the conductive pin 13 are connected to the lead frame 9. connection to ensure a good electrical connection between the chip and the lead frame.

[0014] The crystal 10 is connected with the lead frame 9 by a metal connection wire 14 to ensure that the crystal 10 and ...

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Abstract

The invention discloses a crystal package mould, comprising a chipset and a package mould group, wherein the package mould group comprises an upper cover and a lower base, a cavity is formed in the upper cover, the upper surface of the cavity is an inner top surface on which a buffer layer is arranged, the chipset comprises a lead frame above which a crystal is arranged, a metal conductor is arranged above the crystal, the crystal is connected and fixed with the metal conductor and the lead frame by an adhesive respectively, the metal conductor is provided with conductive pins, and the tail ends of the conductive pins are connected with the lead frame. The crystal package mould provided by the invention is simple in structure and convenient to operate; the purpose of not crushing the chipset during the packaging process is achieved by arranging the buffer layer on the top end of the cavity of the package mould group, the preparation rate and product quality of chips are improved, and the package cost is reduced.

Description

technical field [0001] The invention relates to a mold, in particular to a packaging mold. Background technique [0002] Chip packaging is usually completed with packaging molds. Generally, after the crystal is assembled into a chip group, due to errors in the crystal assembly process, there is a certain difference in the height of the crystal after being assembled into a chip group. Then the packaging process is , the height of the package space of the package mold is fixed. Therefore, when the chip set is packaged, the chip will be crushed because the chip set is too high, or the sealing glue will overflow because the chip set is too low. [0003] Therefore, those skilled in the art are devoting themselves to developing a packaging mold that will not crush the chip and will not overflow the sealant. Contents of the invention [0004] In view of the above-mentioned defects in the prior art, the technical problem to be solved by the present invention is to provide a pack...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/56
CPCH01L21/67126H01L21/565
Inventor 肖迟容
Owner 重庆市靳彬农业科技有限公司
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