Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Cover plate for PCB drilling

A cover plate and substrate technology, applied in the field of PCB drilling cover plate, can solve the problems of low hole position accuracy, low drilling efficiency, poor chip removal effect, etc., to suppress relative movement, improve chip removal effect, and eliminate voids Effect

Inactive Publication Date: 2016-05-04
烟台柳鑫新材料科技有限公司
View PDF9 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a cover plate for PCB drilling, which aims to solve the problem that there is a gap between the traditional cover plate and the PCB board, resulting in the occurrence of edging, hole position, etc. during the drilling process. Problems of low precision, low drilling efficiency and poor chip removal

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Cover plate for PCB drilling

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0013] The present invention provides a cover plate for PCB drilling. In order to make the purpose, technical solution and effect of the present invention clearer and clearer, the present invention will be further described in detail below. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0014] figure 1 It is a structural diagram of a preferred embodiment of a PCB drilling cover plate of the present invention, as shown in the figure, it includes an original cover plate 1 and an adhesive resin layer 2 coated on the back of the original cover plate 1 . In the present invention, an adhesive resin layer is added to the back of the original cover plate 1 (that is, the traditional cover plate). The ridges that should appear on the surface of the PCB board are transferred to the surface of the cover plate, so that there is no ridge on the surface of the PCB board, and the gap b...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a cover plate for PCB drilling. The cover plate comprises an original cover plate and an adhesive resin layer on the back of the original cover plate. According to the cover plate for PCB drilling, the back of the original cover plate is added with the adhesive resin layer, accordingly, the cover plate can be firmly attached to the surface of a to-be-drilled PCB plate in the using process, a clearance between the cover plate and the to-be-drilled PCB plate is prevented from being produced, and the cover plate and the to-be-drilled PCB plate are integrally formed. Burr to be appeared on the surface of the PCB plate is transferred to be on the surface of the cover plate, and the clearance between the cover plate and the PCB plate is prevented from being produced; accordingly, the hole position precision is improved, the chip discharging effect is improved, and meanwhile the cover plate is inhibited from moving relatively on the surface of the PCB plate.

Description

technical field [0001] The invention relates to the field of cover plates, in particular to a cover plate for PCB drilling. Background technique [0002] The cover plates used before are naturally placed on the surface of the PCB board to be drilled, and fixed with clamps or with masking tape around them. There will inevitably be a gap between the traditional cover plate and the PCB board, and the following problems will occur during the drilling process: (1) The gap will cause the copper foil on the surface of the PCB board to be lifted when the drill needle is lifted, forming a larger (2) The existence of the gap will cause uneven resistance to the drill needle when it enters the drill, and the deviation will occur, and the hole position accuracy will be reduced; (3) The existence of the gap will cause the cover plate and the The relative movement of the PCB board affects the drilling efficiency; (4) Part of the powder chips will be sucked into the gap during the drilling...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B26D7/00B32B15/08B32B27/10
CPCB26D7/00B26D2007/0012B32B15/08B32B27/10B32B2250/02
Inventor 秦先志罗小阳唐甲林贺瑜
Owner 烟台柳鑫新材料科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com