A device and method for improving the uniformity of wafer etching

Abstract

The invention discloses a device and method for improving corrosion uniformity of a chip. The device comprises a first spraying arm and a first spraying device, wherein the first spraying device is arranged on the first spraying arm capable of driving the first spraying device to rotate and / or lift, the length of the first spraying arm is consistent with the radius or diameter of the chip, and a chemical liquid sprayed from the first spraying device can instantly and simultaneously cover the surface of the chip. By arranging the first spraying device, the chemical liquid can instantly and simultaneously cover the surface of the chip with the high-speed rotation state of the chip during spraying the chemical liquid, so that all parts of the surface of the chip simultaneously react with the chemical liquid, the problem that the corrosion rate at an initial spraying point of the chemical liquid is higher than those of other parts of the chip in the prior art is solved, and the corrosion uniformity of the chip is improved; and further, during the chip corrosion process, the corrosion rate of the chip also can be accurately controlled by adjusting the swinging rate of a second spraying device, and the corrosion uniformity of the chip is further improved.

Description

Technical field [0001] The invention relates to the field of semiconductor devices and processing and manufacturing, and more specifically, to a device and method for improving the uniformity of wafer corrosion. Background technique [0002] As the feature size of integrated circuits continues to shrink, the requirements for the cleanliness and flatness of the oxide film on the wafer surface are getting higher and higher. If the thickness of the oxide film on the wafer surface exceeds the limit, it will directly affect the quality of the subsequent process, resulting in the failure of the integrated circuit chip. The performance deteriorates and the product yield rate decreases. Although the flatness of the oxide film can be controlled by changing the oxidation process conditions, the uniformity of the wafer film thickness still needs to be further improved after the process. Monolithic wet etching has become a very important technology to improve the uniformity of film thicknes...

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a device and method for improving the uniformity of wafer corrosion, so as to solve the problem that the corrosion rate of chemical liquid at the starting point is higher than that of other parts of the wafer, and improve the uniformity of wafer corrosion.

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