Method for reducing lateral erosion amount of copper microelectrode of piezoelectric ink-jet printing head by adopting multi-step corrosion

Abstract

The invention belongs to the technical field of metal microelectrode preparation in the field of MEMS, and relates to a method for reducing the lateral erosion amount of a copper microelectrode of a piezoelectric ink-jet printing head through multi-step corrosion. In the method for preparing a copper microelectrode of a piezoelectric ink-jet printing head by adopting a multi-step corrosion method,a copper electrode masking layer is prepared by using a photoetching process in an MEMS technology, the surface of an exposed copper electrode is corroded to generate an intermediate product CuCl, and a solution capable of removing CuCl without corroding copper is used for corroding CuCl to obtain a copper microelectrode structure with small lateral erosion. By adopting the method disclosed by the invention, the residence time of the copper electrode in the FeCl3 solution can be greatly reduced, so that the lateral erosion amount of the side wall of the copper electrode is effectively reduced, and the corrosion uniformity is improved. The piezoelectric ink-jet printing head copper microelectrode structure prepared by the method is simple in manufacturing process, low in cost and good in process repeatability.

Description

technical field

[0001] The invention belongs to the technical field of metal microelectrode preparation in the field of MEMS, and in particular relates to a method for reducing the amount of side erosion of a copper microelectrode of a piezoelectric inkjet printing head by using multi-step corrosion. Background technique

[0002] Piezoelectric inkjet printing technology has been expanded from the traditional printing industry to the fields of electronics, biology and rapid prototyping technology due to its advantages of miniaturization, mass production and long life; as the driving element of piezoelectric inkjet printing head, electrodes Material selection, manufacturing quality, and patterning process have a great influence on the vibration amplitude and vibration shape of the overall device. Metal Cu has been widely used in the field of microelectronic devices due to its excellent electrical conductivity, thermal conductivity and elasticity, and it is mostly used in the f...

Examples

Embodiment 1

[0028] (1) The piezoelectric inkjet printing head copper microelectrode film 2 was prepared by magnetron sputtering. First put the print head substrate 6 of the existing PZT substrate 5 on the hot plate before drying at 150°C to remove moisture, put it in the sputtering apparatus and evacuate it to 3.0×10 -5 Pass into the inert gas Ar after Pa; After the vacuum degree reaches 1.5Pa, sputter the Cr film 4 of 80nm and the Au film 3 of 200nm on the PZT substrate 5 successively, for increasing the binding force of the copper microelectrode film 2 and the PZT substrate 5 ; Then sputter the copper microelectrode film 2 of 600nm.

[0029] (2) Spin-coat one deck BP212 photoresist masking layer 1 on the copper microelectrode film base 2 of the piezoelectric inkjet printing head, the spin-coating speed of BP212 photoresist masking layer 1 is 600rpm at a low speed, and bake before the hot plate The temperature is 85 degrees, the time is 30min, and the exposure intensity is 3mW / cm 2 , t...

Embodiment 2

[0033] (1) The piezoelectric inkjet printing head copper microelectrode film 2 was prepared by magnetron sputtering. First put the print head substrate 6 with the existing PZT substrate 5 on the hot plate before drying at 150°C to remove moisture, put it in the sputtering apparatus and evacuate it to 3.0×10 -5 Pass into the inert gas Ar after Pa; After the vacuum degree reaches 1.5Pa, sputter the Cr film 4 of 80nm and the Au film 3 of 200nm on the PZT substrate 5 successively, for increasing the binding force of the copper microelectrode film 2 and the PZT substrate 5 ; Then sputter the copper microelectrode film 2 of 600nm.

[0034] (2) Spin-coat one deck BP212 photoresist masking layer 1 on the copper microelectrode film substrate 2 of the piezoelectric inkjet printing head, the spin-coating speed of BP212 photoresist masking layer 1 is a high speed 2200rpm, and bake before the hot plate The temperature is 90 degrees, the time is 20min, and the exposure intensity is 4mW / cm ...

Embodiment 3

[0041] (1) A piezoelectric inkjet printhead copper microelectrode film 2 was prepared by using a magnetron sputtering apparatus, which was consistent with the method in Example 2, and finally a 500 nm copper microelectrode film 2 was obtained by sputtering.

[0042] (2) Spin-coat one deck BP212 photoresist masking layer 1 on the copper microelectrode film substrate 2 of the piezoelectric inkjet printing head, the spin-coating speed of BP212 photoresist masking layer 1 is 1400rpm, and the baking temperature before the hot plate The temperature is 80 degrees, the time is 25min, and the exposure intensity is 3.2mW / cm 2 , the exposure time is 95s, the NaOH solution with a mass fraction of 0.3% is used for development for 35s, and the film is hardened with a hot plate at 80°C for 25min to obtain a pattern of the masking layer.

[0043] (3) the copper film electrode piece that step (2) obtains with BP212 photoresist masking layer 1 and copper microelectrode film 2 is placed in FeCl ...

technical field

[0001] The invention belongs to the technical field of metal microelectrode preparation in the field of MEMS, and in particular relates to a method for reducing the amount of side erosion of a copper microelectrode of a piezoelectric inkjet printing head by using multi-step corrosion. Background technique

[0002] Piezoelectric inkjet printing technology has been expanded from the traditional printing industry to the fields of electronics, biology and rapid prototyping technology due to its advantages of miniaturization, mass production and long life; as the driving element of piezoelectric inkjet printing head, electrodes Material selection, manufacturing quality, and patterning process have a great influence on the vibration amplitude and vibration shape of the overall device. Metal Cu has been widely used in the field of microelectronic devices due to its excellent electrical conductivity, thermal conductivity and elasticity, and it is mostly used in the f...

Examples

Embodiment 1

[0028] (1) The piezoelectric inkjet printing head copper microelectrode film 2 was prepared by magnetron sputtering. First put the print head substrate 6 of the existing PZT substrate 5 on the hot plate before drying at 150°C to remove moisture, put it in the sputtering apparatus and evacuate it to 3.0×10 -5 Pass into the inert gas Ar after Pa; After the vacuum degree reaches 1.5Pa, sputter the Cr film 4 of 80nm and the Au film 3 of 200nm on the PZT substrate 5 successively, for increasing the binding force of the copper microelectrode film 2 and the PZT substrate 5 ; Then sputter the copper microelectrode film 2 of 600nm.

[0029] (2) Spin-coat one deck BP212 photoresist masking layer 1 on the copper microelectrode film base 2 of the piezoelectric inkjet printing head, the spin-coating speed of BP212 photoresist masking layer 1 is 600rpm at a low speed, and bake before the hot plate The temperature is 85 degrees, the time is 30min, and the exposure intensity is 3mW / cm 2 , t...

Embodiment 2

[0033] (1) The piezoelectric inkjet printing head copper microelectrode film 2 was prepared by magnetron sputtering. First put the print head substrate 6 with the existing PZT substrate 5 on the hot plate before drying at 150°C to remove moisture, put it in the sputtering apparatus and evacuate it to 3.0×10 -5 Pass into the inert gas Ar after Pa; After the vacuum degree reaches 1.5Pa, sputter the Cr film 4 of 80nm and the Au film 3 of 200nm on the PZT substrate 5 successively, for increasing the binding force of the copper microelectrode film 2 and the PZT substrate 5 ; Then sputter the copper microelectrode film 2 of 600nm.

[0034] (2) Spin-coat one deck BP212 photoresist masking layer 1 on the copper microelectrode film substrate 2 of the piezoelectric inkjet printing head, the spin-coating speed of BP212 photoresist masking layer 1 is a high speed 2200rpm, and bake before the hot plate The temperature is 90 degrees, the time is 20min, and the exposure intensity is 4mW / cm ...

Embodiment 3

[0041] (1) A piezoelectric inkjet printhead copper microelectrode film 2 was prepared by using a magnetron sputtering apparatus, which was consistent with the method in Example 2, and finally a 500 nm copper microelectrode film 2 was obtained by sputtering.

[0042] (2) Spin-coat one deck BP212 photoresist masking layer 1 on the copper microelectrode film substrate 2 of the piezoelectric inkjet printing head, the spin-coating speed of BP212 photoresist masking layer 1 is 1400rpm, and the baking temperature before the hot plate The temperature is 80 degrees, the time is 25min, and the exposure intensity is 3.2mW / cm 2 , the exposure time is 95s, the NaOH solution with a mass fraction of 0.3% is used for development for 35s, and the film is hardened with a hot plate at 80°C for 25min to obtain a pattern of the masking layer.

[0043] (3) the copper film electrode piece that step (2) obtains with BP212 photoresist masking layer 1 and copper microelectrode film 2 is placed in FeCl ...

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