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Device and method for improving wafer corrosion uniformity

A uniformity and wafer technology, which is applied in the field of devices for improving wafer corrosion uniformity, can solve problems such as wafer corrosion unevenness, achieve uniform wafer corrosion, improve wafer corrosion uniformity, and improve wafer middle thinness Effect

Active Publication Date: 2017-01-25
BEIJING SEVENSTAR ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a device and method for improving the uniformity of wafer corrosion, thereby solving the problem of uneven wafer corrosion

Method used

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  • Device and method for improving wafer corrosion uniformity
  • Device and method for improving wafer corrosion uniformity
  • Device and method for improving wafer corrosion uniformity

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Please refer to figure 2 and Figure 4 A device for improving the uniformity of wafer corrosion provided by the present invention includes a wafer carrier (not shown in the figure), the upper end of the wafer carrier carries a wafer 1, and the wafer carrier includes a rotating mechanism and Fixing mechanism; the lower end of the wafer carrier is provided with at least one fan-shaped part 2, and the wafer carrier can rotate and drive the wafer 1 or the fan-shaped part 2. The fan-shaped part 2 is consistent with the radius of the wafer 1 and is in line with the The circle 1 is located on the concentric axis, and the surface of the fan-shaped part 2 is provided with spray holes 3 that can vertically spray liquid to the back of the wafer 1. The spray holes 3 are divided into different parts according to the direction of the fan-shaped part 2 from the center of the circle to the arc Sectors, the injection holes 3 of each sector are independently connected to the pipeline 4...

Embodiment 2

[0036] Please refer to figure 2 and Figure 5 , on the basis of Embodiment 1, the injection holes 3 in each area are connected to the two-way pipeline 4, and the two-way pipeline 4 is respectively provided with a valve 5 that can control the passage of the injection liquid, and the injection liquid is preferably ultrapure water ( UPW), the valve 5 on the first pipeline 41 controls the flow of hot ultrapure water (ie Hot UPW), and the valve 5 on the second pipeline 42 controls the flow of cold ultrapure water (ie Cold UPW).

[0037] In this embodiment, the flow rate of the hot spray liquid is constant, and the flow rate of the cold spray liquid gradually decreases according to the direction of the fan-shaped part 2 from the center of the circle to the arc. By controlling the flow rate of the cold spray liquid that each sector pipeline 4 passes through, the cold spray liquid is mixed with the hot spray liquid, so that the spray holes 3 of each sector are sprayed with spray liq...

Embodiment 3

[0040] Please refer to image 3 , on the basis of Embodiment 1 or Embodiment 2, a bar-shaped body 6 is provided in the opposite direction of the center of the horizontal axis of the fan-shaped part 2, and the bar-shaped body 6 is connected with the center of the fan-shaped part 2, and the bar-shaped The body 6 is provided with several drying holes 7 for passing the drying gas. Preferably, the length of the strip 6 is consistent with the radius of the wafer 1, and the gas passing through the drying hole 7 is nitrogen.

[0041] In order to further improve the present invention, when the wafer 1 is installed on the rotating mechanism, the fan-shaped part 2 is installed on the fixing mechanism; the wafer 1 and the fan-shaped part 2 perform relative rotation, that is, the wafer 1 does Horizontal rotation movement, the fan-shaped part 2 is fixed, and the injection holes 3 on the fan-shaped part 2 vertically spray liquid to the back of the wafer 1 .

[0042] Or the fan-shaped part 2 ...

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Abstract

The invention discloses a device and a method for improving wafer etching uniformity. The device comprises a wafer carrier, wherein the wafer carrier comprises a rotating mechanism and a fixed mechanism; the upper end of the wafer carrier bears a wafer; the lower end of the wafer carrier is provided with at least one fan-shaped part; the wafer carrier can rotate and drive the wafer or the fan-shaped part; the fan-shaped part and the wafer have the same radius and are positioned on a concentric shaft; the surface of the fan-shaped part is provided with jet holes capable of being used for perpendicularly jetting liquid to the back of the wafer; the jet holes are divided in different sections along the direction from the circle center to the arc of the fan-shaped part; the jet holes in each section are independently connected with a pipeline for jetted liquid to pass through; each pipeline is provided with a valve capable of controlling the passing time or / and flow of the jetted liquid. The device is simple in structure and easy to operate, a phenomenon that the wafer is thin in the middle and thick on the edge is improved, and an effect of uniformly etching the wafer is finally achieved.

Description

technical field [0001] The invention relates to the field of semiconductor devices and processing and manufacturing, more specifically, to a device and method for improving uniformity of wafer corrosion. Background technique [0002] As we all know, wet etching and wet cleaning have been widely accepted in semiconductor production a long time ago. The wet etching process is widely used due to its low cost, high output, high reliability and its excellent selection ratio. . However, many problems inevitably arise during the application of the wet etching process, such as the problem of poor etching uniformity on the wafer surface. The uneven corrosion of the wafer surface will directly affect the quality of the subsequent process, resulting in the deterioration of the performance of the integrated circuit chip and the decline of the product qualification rate. [0003] In the existing process, the spray arm structure is used to spray chemical liquid onto the surface of the r...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/30604H01L21/6708
Inventor 冯晓敏史彦慧吴仪
Owner BEIJING SEVENSTAR ELECTRONICS CO LTD
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