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rupture device

A breaking and loading technology, applied in glass cutting devices, fine working devices, manufacturing tools, etc., can solve the problems of general products without suitable structure, inconvenience, and inability to break with high precision

Active Publication Date: 2021-07-16
MITSUBOSHI DIAMOND IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the occurrence of the above-mentioned positional shift or floating, there is a problem that breaking can not be performed with high precision
[0005] This shows that the above-mentioned existing breaking device obviously still has inconvenience and defects in structure and use, and needs to be further improved urgently.
In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but for a long time no suitable design has been developed, and the general product has no suitable structure to solve the above-mentioned problems. This is obviously the relevant industry. Urgent problem

Method used

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Embodiment Construction

[0042] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the specific implementation, structure, characteristics and features of a breaking device proposed according to the present invention will be described below in conjunction with the accompanying drawings and preferred embodiments. Efficacy, detailed as follows.

[0043]

[0044] figure 1 It is a perspective view of main parts of the breaking device 100 according to this embodiment, especially the main parts related to supporting the object W to be broken. again, figure 2 is through figure 1 An enlarged perspective view of the section of the A-A' part of . image 3 It is a schematic cross-sectional view including main components of the breaking device 100 .

[0045] The fracturing device 100 of this embodiment is, in general, a device as follows: on the upper surface of the stage 1, the object W to be cleaved, which is in a planar ...

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Abstract

The present invention relates to a breaking device which suppresses position shifting or lifting during breaking. The fracturing device is configured as follows, and includes: a loading part, which is rectangular in plan view, and places a plurality of severing target objects parallel to each other and fixed at equal intervals; and a position deviation restricting part, Corresponding to the four sides of the loading part, they are arranged independently of each other; each position deviation limiting part is respectively in the horizontal plane, and is a plurality of unit teeth extending toward the side end of the loading part to be connected with a plurality of predetermined breaking positions. Comb teeth arranged at equal intervals at equal intervals, and the adjacent unit teeth are arranged in an equidistant manner relative to a predetermined breaking position; Set the limit position for position deviation during breaking when the breaking target object fixed on the mounting part is separated.

Description

technical field [0001] The present invention relates to devices for fracturing substrates of brittle materials, and more particularly to their construction. Background technique [0002] A brittle material substrate (such as a glass substrate or a ceramic substrate, etc.) or a thin film layer or A device for breaking (fracturing) an object to be broken such as a rear film layer along the scribe line is known (for example, refer to Patent Document 1). [0003] Patent Document 1: Japanese Patent Laid-Open No. 2014-195040 [0004] When using the breaking device disclosed in Patent Document 1, and sequentially breaking along each scribed line of a brittle material substrate formed with a plurality of scribed lines parallel to each other, there is a possibility that the broken substrate may be slightly damaged. There is a case of positional deviation. The positional shift is likely to occur especially when the vicinity of the end of the substrate is broken, and in this case, t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D1/00B28D5/00C03B33/033C03B33/02
Inventor 岩坪佑磨太田欣也
Owner MITSUBOSHI DIAMOND IND CO LTD