Coating adsorption device for BGA substrate

Abstract

The invention discloses a coating adsorption device for a BGA substrate. The coating adsorption device comprises a bottom plate, wherein the bottom plate is provided with four bearing adsorption mechanisms; each bearing adsorption mechanism is arranged at one side of each of four edges of the upper end surface of the bottom plate; each bearing adsorption mechanism comprises a linear guide rail, a support plate, a vertical plate and a bearing plate; each linear guide rail is arranged at the upper end surface of the bottom plate; each support plate is arranged on the corresponding linear guide rail in a sliding manner; each vertical plate is fixed on the corresponding support plate; each bearing plate is fixed on the corresponding vertical plate; an adsorption tank which is longitudinally distributed along the corresponding bearing plate is molded on the upper end surface of the corresponding bearing plate; a plurality of first suction pipes are connected to the inner walls of the bottom parts of the adsorption tanks; the first suction pipes are connected with a vacuum pump; a support block which protrudes upwards is molded in the middle part of the upper end surface of the bottom plate; the upper end surface of the support block is connected with a plurality of second suction pipes; and the plurality of second suction pipes are connected with the vacuum pump. The BGA substrate is not easily broken; and the middle part of the BGA substrate can be prevented from protruding, so that the coating accuracy and quality of soldering paste are ensured.

Description

Technical field: [0001] The invention relates to the technical field of BGA equipment, in particular to an adsorption device used when coating solder paste on a BGA substrate. Background technique: [0002] BGA is a packaging method for integrated circuits using an organic carrier board. Because of its advantages of reduced packaging area, easy tinning, high reliability, good electrical performance, and low overall cost, it is favored by consumers. In mass production, workers usually use a fully automatic printing machine for printing (that is, coating solder paste). When the BGA substrate enters the printing machine and is coated with solder paste, it needs to be fixed in the printing machine. The printing machine fixes the BGA substrate The best way is usually to use the transmission guide rail for fixing and positioning. For thinner and fragile BGA substrates, when the BGA substrate is placed on the transfer guide rails of the printing machine and enters the proper posit...

AI Technical Summary

Problems solved by technology

For thinner and fragile BGA substrates, when the BGA substrate is placed on the transfer guide rails of the printing machine and enters the proper position, the two transfer guide rails will clamp the BGA substrate towards each other, which will cause the middle part of the BGA substrate to slightly bulge ; On the one hand, the clamping force is easy to break the BGA substrate; on the other hand, due to the protrusion in the middle of the BGA substrate, the solder paste coating surface on the BGA substrate is uneven, which affects the coating quality of the solder paste, and it is necessary to improve

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