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Moore space-filling curve-based slotted broadband UC-EBG structure and design method thereof

A space filling curve, UC-EBG technology, applied in the direction of radiating element structure and other directions, can solve the problems of increasing equivalent inductance, complex surface pattern, increasing processing difficulty, etc., to achieve a wide range of effects

Inactive Publication Date: 2016-06-01
BEIJING UNIV OF POSTS & TELECOMM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Using these two methods can broaden the bandwidth to about 49%-68%. However, increasing the equivalent inductance will make the surface pattern more complex and increase the difficulty of processing. The use of multi-via method will also complicate the processing.

Method used

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  • Moore space-filling curve-based slotted broadband UC-EBG structure and design method thereof
  • Moore space-filling curve-based slotted broadband UC-EBG structure and design method thereof
  • Moore space-filling curve-based slotted broadband UC-EBG structure and design method thereof

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Embodiment Construction

[0040] The substantive characteristics of the present invention are further illustrated by the following specific embodiments:

[0041] (1) Design the MSF-UC-EBG structural unit. Design of the slotted MSF-UC-EBG structural unit according to the third-order molar space-filling curve, assuming period size L msf , the slot width is w, and the slot spacing is g.

[0042] (2) Determine the specific parameters through numerical modeling: the numerical modeling adopts the suspended microstrip line model. Firstly, the S-parameters of the MSF-UC-EBG structure were simulated using the FR4 dielectric substrate. By adjusting the thickness h of the dielectric substrate, the periodic unit size L msf , groove width w, groove spacing g and the number N of periodic units and other parameters. A set of optimization parameters was finally determined: ε r =4.4mm, w=1.6mm, g=1.9mm, gap=1.9mm, h=1.0mm, wid_gap=2mm, len_gap=2mm, strip=10mm, N=5. The forbidden band gap is 1.43-5.89GHz, and the ...

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Abstract

The invention relates to a moore space-filling curve (Moore space-filling curve, MSF)-based slotted broadband uniplanar compact electromagnetic band gap (Uniplanar Compact Electromagnetic Band Gap, UC-EBG) structure and a design method thereof, and belongs to the technical field of electromagnetic transmitting and receiving. The UC-EBG structure designed by the method has the characteristics of a broadband and an adjustable band gap. On the basis of the same structure, three UC-EBG structures of which the band gaps are 1.43-5.89GHz, 1.09-4.57GHz and 52.5-66.7GHz respectively are obtained by changing physical dimensions and dielectric plate materials when five MSF-UC-EBG structure units are periodically arranged. The dielectric plate materials of the three EBG structures are an FR4 plate, a Rogers RO3010 plate and the RF4 plate respectively; and the relative bandwidths are 121.8%, 122.9% and 23.8% respectively. The designed MSF-UC-EBG can be widely applied to a GSM, a PCS, a Bluetooth, a Wi-max and a microwave antenna.

Description

technical field [0001] The invention relates to a slotted broadband coplanar compact electromagnetic bandgap (UniplanarCompactElectromagneticBandGap, UC-EBG) structure based on a third-order Moorespace-filling curve (Moorespace-fillingcurve) and a design method thereof, belonging to the technical field of electromagnetic transmission and reception . Background technique [0002] 1. Moore space filling curve [0003] The Moore curve is a variant of the Hilbert curve. figure 1 (a) and (b) depict the 1-4 order Hilbert curve and Moore curve, respectively. Like the Hilbert curve, the Moore curve is also a space-filling curve. [0004] Assume that the side length of the Moore space curve is represented by L, the order is represented by n, and the length of each line segment is represented by d n Indicates that the total length of all line segments is denoted by S n Indicates that the relationship between L, dn and Sn is: [0005] d n ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01Q1/38
CPCH01Q1/38
Inventor 田慧平张璟次国平王宁曹亚杰
Owner BEIJING UNIV OF POSTS & TELECOMM
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