Radio-frequency vertical connection circuit between two-dimensional millimeter wave modules

Abstract

The invention provides a radio-frequency vertical connection circuit between two-dimensional millimeter wave modules, aiming at the radio-frequency vertical connection circuit with higher reliability and more convenient assembly and disassembly. The radio-frequency vertical connection circuit is implemented through the following technical scheme: an upper module metal structural member (2) and a lower module metal structural member (4) are fixed through a screwed way or the other detachable way, and the lower end of the upper module metal structural member and the upper end of a lower module two-dimensional multi-chip circuit board component (3) are in pressure fit; a coaxial connector (5) is welded in the upper module metal structural member, so that a vertical circuit connection between an upper module two-dimensional multi-chip circuit board component (1) and the lower module two-dimensional multi-chip circuit board component is realized; and a fuzz button (53) is coaxially connected to a probe (54) of a step cylinder structure, and a small end of the probe (54) is higher than an outer circle insulating layer (52) to be in contact with the lower module two-dimensional multi-chip circuit board component. The radio-frequency vertical connection circuit has the advantages of simple structure, small insertion and extraction force and easiness in assembly and disassembly.

Description

technical field [0001] The invention relates to a radio frequency vertical connection circuit between modules based on fur buttons, which is applicable to the millimeter wave technical field, and is especially suitable for the radio frequency connection between mechanically separable modules. Background technique [0002] With the development of communication technology, the application range of millimeter wave modules in electronic equipment such as radar antennas continues to expand. The volume of millimeter wave modules is getting smaller and smaller, and their integration is getting higher and higher. Millimeter-wave electronic devices are gradually developing from traditional two-dimensional assembly to three-dimensional three-dimensional assembly, and three-dimensional three-dimensional assembly inevitably needs to solve the problem of vertical interconnection. Vertical interconnection refers to the interconnection required when designing power, ground, and RF signals ...

AI Technical Summary

Problems solved by technology

[0003] The traditional radio frequency connection method of the millimeter wave module is mainly based on the radio frequency coaxial socket of the pin and the jack. The disadvantage of this connection method is that it occupies a large volume. The assembly seriously affects the assembly of the equipment

BGA is vertically interconnected by planting BGA balls on the surface of two-dimensional multi-chip circuit board components. The disadvantages of this method are weak environmental test resistance, poor radio frequency transmission performance, and no ability to repeatedly disassemble

Z-direction conduction is to fill the conductive glue that only conducts in the vertical direction between two two-dimensional multi-chip circuit board components, but its transmission frequency is low, the loss is large, and the maintainability is poor.

The elastic connector based on the fur button can realize the elastic touch connection, but if the fur button is not supported and protected, the braided copper wire may fall apart and fail after being squeezed, and the fur button is easy to fall out during assembly ,Affect the assembly

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